ATP15-2P-BM02GRY >
ATP15-2P-BM02GRY
Amphenol Sine Systems Corp
2 POSITION STRAIGHT PCB FLANGE M
10300 Pcs New Original In Stock
Connector Header Panel Mount, Through Hole 2 position 0.264" (6.71mm)
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ATP15-2P-BM02GRY Amphenol Sine Systems Corp
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ATP15-2P-BM02GRY

Product Overview

3809899

DiGi Electronics Part Number

ATP15-2P-BM02GRY-DG
ATP15-2P-BM02GRY

Description

2 POSITION STRAIGHT PCB FLANGE M

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10300 Pcs New Original In Stock
Connector Header Panel Mount, Through Hole 2 position 0.264" (6.71mm)
Quantity
Minimum 1

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ATP15-2P-BM02GRY Technical Specifications

Category Rectangular Connectors, Headers, Male Pins

Manufacturer Amphenol Sine Systems

Packaging Bulk

Series BoardLock™ ATP

Product Status Active

Connector Type Receptacle

Contact Type Male Pin

Pitch - Mating 0.264" (6.71mm)

Number of Positions 2

Number of Rows 1

Row Spacing - Mating -

Number of Positions Loaded All

Style Board to Cable/Wire

Shrouding Shrouded - 4 Wall

Mounting Type Panel Mount, Through Hole

Termination Solder

Fastening Type Latch Holder

Contact Length - Mating -

Contact Length - Post 0.181" (4.60mm)

Overall Contact Length -

Insulation Height 1.339" (34.00mm)

Contact Shape Circular

Contact Finish - Mating Gold

Contact Finish Thickness - Mating -

Contact Finish - Post Gold

Contact Material Copper Alloy

Insulation Material Thermoplastic

Features Board Lock, Mounting Flange, Potting Wall, Sealed

Operating Temperature -55°C ~ 125°C

Ingress Protection IP67

Material Flammability Rating -

Insulation Color Gray

Current Rating (Amps) 25A

Voltage Rating 250V

Mated Stacking Heights -

Contact Finish Thickness - Post -

Applications -

Base Product Number ATP15-2P

Datasheet & Documents

HTML Datasheet

ATP15-2P-BM02GRY-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Additional Information

Other Names
889-ATP15-2P-BM02GRY
Standard Package
100

Connector Header Panel Mount ATP15-2P-BM02GRY from Amphenol Sine Systems Corp Detailed Product Insight and Specifications

- Frequently Asked Questions (FAQ)

Product Overview of Amphenol ATP15-2P-BM02GRY

The Amphenol ATP15-2P-BM02GRY connector represents a two-position, straight PCB flange mount receptacle header within the ATP series, engineered specifically for board-to-cable or board-to-wire interconnections. Its design integrates through-hole termination on a printed circuit board (PCB), flange mounting for mechanical fastening, and a shrouded shell for alignment and polarization control. Understanding the technical aspects and engineering considerations of this connector requires examining its fundamental electrical and mechanical construction, termination methodology, structural features, and application implications.

Fundamentally, the connector utilizes a two-position contact arrangement, implying two conductive paths are available for signal or power transmission. This configuration suits low to moderate pin count requirements, balancing simplicity with reliable engagement. Each contact is embedded in a housing designed for insertion into PCB holes (through-hole technology), where solder joints provide mechanical anchoring and electrical continuity. This termination method contrasts with surface-mount technology (SMT), often preferred when space or automated assembly considerations dominate. However, through-hole designs typically yield enhanced mechanical retention, particularly advantageous in environments subjected to vibration or mechanical stress, such as industrial machinery or field-deployed equipment.

The flange mount format incorporates a mechanical interface allowing the connector to be affixed securely onto panel surfaces or equipment chassis, bridging external cable harnesses with internal PCB circuitry. Flange mounting adds stability by distributing mechanical forces across a broader area compared to simple board-mounted headers, thereby reducing strain on solder joints and improving connector longevity. The straight orientation aligns the mating interface perpendicular to the PCB surface, simplifying cable routing in scenarios where connectors protrude directly from enclosure panels or boards.

Structurally, the ATP15-2P-BM02GRY employs a four-wall shrouded design, wherein the pin contacts reside within a protective cavity bounded by four enclosing walls. This approach primarily enhances connector mating reliability through physical polarization and alignment features. Polarization ensures that mating connectors can only engage in the intended orientation, minimizing risks of reversed connections that could cause electrical failures or damage. The extended walls guide the opposing plug during insertion, reducing angular misalignment and stress on pins. Moreover, the shielding effect of the shroud guards the contacts against incidental mechanical impacts, mitigating pin bending or deformation during handling or assembly.

From an electrical performance standpoint, through-hole contacts generally offer consistent impedance and better thermal dissipation, factors relevant to signal integrity and connector current capacities. While the specific ATP15-2P-BM02GRY datasheet parameters such as contact resistance, voltage rating, current rating, and dielectric strength are essential to match application demands, the two-position configuration and robust mechanical design suggest its use in low to moderate power or signal-level interconnects rather than high-frequency or high-current scenarios, where specialized contact materials or geometries might be required.

Selecting this connector involves considering several trade-offs tied to application constraints. The through-hole, flange mount design typically increases PCB real estate and assembly complexity compared to SMT options but offers improved mechanical robustness. The relatively low number of positions limits its usage in high-density applications, emphasizing its role where primary concerns involve secure mechanical fastening and straightforward wiring. The shrouded design, while improving durability and mating accuracy, may influence connector footprint and mating force considerations, factors important when integrating into tight enclosure spaces or systems requiring frequent mating cycles.

In practical engineering contexts, the ATP15-2P-BM02GRY suits medium-duty industrial controls, instrumentation panels, or embedded electronic devices that interface external wiring harnesses to PCBs with moderate pin count needs and mechanical stability requirements. Its design mitigates common issues such as pin damage during assembly and unintentional mis-mating through its shrouded interface, contributing to reduced rework and maintenance efforts. When specifying this connector, assessing compatibility with mating plugs, ensuring alignment with conductor gauge and insulation types, and verifying panel cutout dimensions aligned with flange mount constraints are crucial to secure proper mechanical and electrical integration.

Altogether, the structural and termination attributes of this Amphenol connector reflect deliberate engineering choices aimed at balancing durability, assembly reliability, and application adaptability within industrial and electronic equipment environments where moderate connectivity complexity and mechanical assurance take precedence over miniaturization or high-frequency performance.

Mechanical Design and Physical Characteristics of ATP15-2P-BM02GRY

The ATP15-2P-BM02GRY connector exhibits a mechanical design tailored to balance compact form factor requirements with reliable electrical and mechanical engagement. Its insulation height of approximately 34.0 mm governs the vertical envelope, influencing clearance considerations in panel or enclosure integration. The mating interface features a contact length of 4.60 mm on the pin, a dimension that reflects a balance between contact engagement robustness and minimization of insertion force. This length directly affects factors such as contact retention, wear resistance under multiple mating cycles, and mating reliability under vibratory or thermal stresses.

The pin pitch of 0.264 inches (6.71 mm) aligns with standardized PCB design practices, facilitating signal routing and maintaining spacing sufficient to mitigate crosstalk and dielectric breakdown risks in high-density layouts. The pitch influences trace spacing, impedance control, and manufacturability in surface-mount or through-hole PCB assembly. Selecting this pitch enables compatibility with prevalent industry layouts while supporting signal integrity requirements within typical operating frequencies encountered in industrial or instrumentation applications.

Structured with two rows and one contact per row, the connector’s dual-position configuration addresses requirements where limited signal or power lines are necessary without incurring excess footprint or complexity. This arrangement also affects current-carrying capacity constraints per contact, relevant in applications where conductor gauge and thermal dissipation must be considered. The row and contact count impact connector insertion and extraction forces, as well as alignment during assembly, particularly in mass production environments demanding repeatable mating accuracy.

The housing material selected is a high-performance thermoplastic, chosen for its mechanical robustness, resistance to chemical agents, and ability to withstand environmental stress factors such as temperature cycling, UV exposure, or mechanical abrasion. Thermoplastic insulators contribute to dielectric stability and ensure electrical isolation between contact positions under varying operational conditions. The choice of polymer directly affects compliance with flammability standards, resistance to impact, and mechanical fatigue, all of which influence connector lifetime expectations.

A silicone rubber seal integrated at internal sealing surfaces provides a moisture ingress barrier, a measure critical in applications subject to humidity, condensate, or splash exposure. This elastomeric seal compensates for minor dimensional tolerances and assembly gaps, maintaining IP-rated protection levels by preventing liquid infiltration that could compromise contact integrity or accelerate corrosion. The silicone material's elasticity and resilience support repeated mating cycles without degradation of sealing performance but require compatibility assessment with any lubricants or solvents present in the application environment.

Mounting employs flange fixing with thread-forming screws, specifically recommended as M3.63 x 4 fasteners, tightened to torque values between 11 and 15 in-lb. Such specifications ensure mechanical stabilization sufficient to withstand vibration, shock, and panel flexing without loosening. The thread-forming characteristic facilitates secure mounting in thin panel materials without pre-tapped threads, simplifying assembly while maintaining retention forces within design allowances. Torque control is necessary to prevent housing deformation or screw thread stripping, which could lead to mechanical or sealing failure in long-term use.

Each mechanical and material parameter reflects deliberate design considerations to satisfy integration constraints, environmental exposures, and performance requirements typical in industrial automation, instrumentation, or control system applications. Understanding the interplay between physical dimensions, material properties, sealing methods, and mounting approach provides a framework for assessing suitability based on mechanical fit, environmental resistance, and assembly processes. This insight supports informed selection where connector reliability and service life align with application-specific mechanical and electrical demands.

Electrical Performance Parameters of ATP15-2P-BM02GRY

The electrical performance parameters of the ATP15-2P-BM02GRY connector offer a technical basis for assessing its suitability in various electronic design and procurement contexts, particularly in moderate power distribution and signal integrity applications. Understanding these parameters in depth requires unpacking their testing conditions, underlying physical principles, and implications for reliability, safety, and application scope.

The continuous current rating of 25 A indicates the maximum current the connector can handle under steady-state conditions without excessive temperature rise or material degradation. This rating is derived from the connector’s contact geometry, conductor cross-sectional area, and thermal management characteristics, including heat dissipation through the connector housing and mating surfaces. Engineers evaluating this rating should consider the application’s transient current profiles and duty cycles, as repeated current surges above this threshold risk accelerated contact oxidation or mechanical deformation of the conductive paths. The 25 A rating situates the ATP15-2P-BM02GRY in a moderate power range, suitable for power circuits found in industrial control modules, instrumentation, or small motor drives, rather than heavy power distribution or high-current busbar systems.

Insulation resistance—specified here as a minimum of 1000 MΩ at 25°C—is a critical parameter capturing the connector’s capacity to prevent leakage currents under nominal voltage levels and environmental conditions. This metric depends on the dielectric material properties within the connector, such as the polymeric housing, as well as manufacturing controls affecting surface contamination and voids. Elevated insulation resistance reduces the risk of signal degradation through unintended conduction paths and improves noise isolation. When interpreting this parameter, engineers must account for environmental factors such as humidity, temperature variations, and potential ingress of contaminants, which tend to decrease insulation resistance over time. For applications with sensitive signal transmission or safety-critical isolation requirements, verifying this parameter under worst-case environmental conditions provides a reference for long-term reliability.

The dielectric withstanding voltage rating—defined here by a leakage current limit of less than 2 mA at 1500 VAC—reflects the connector’s ability to electrically isolate adjacent conductors under high-voltage stress without breakdown. This test condition simulates operational scenarios where transient overvoltages or insulation faults might occur. A limit of 2 mA leakage current aligns with widely accepted insulation coordination standards and mitigates risk of insulation failure, corona discharge, or tracking. From a design standpoint, this rating informs the maximum safe voltage margins for the connector's use, guiding system-level clearance and creepage distance considerations. The AC voltage value indicates performance over alternating electric fields, with particular relevance to environments where line voltages or switching surges are common.

Contact plating materials impact both electrical and mechanical performance. The availability of tin or gold finishes provides trade-offs based on corrosion resistance, contact resistance, and cost. Gold plating exhibits a lower and more stable contact resistance due to its chemical inertness and ability to resist surface oxidation. This characteristic is essential in high-reliability environments, such as aerospace, medical devices, or harsh industrial conditions, where maintaining signal integrity over long periods and repeated mating cycles is critical. Tin plating, while more economical, can develop oxide layers that increase contact resistance and potential intermittent connectivity, particularly under vibrations or temperature cycling. The recommendation for gold plating emphasizes the need for stable low-resistance interfaces where signal integrity or sensitive low-current signaling is paramount. Procurement decisions may weigh plating choice against total cost of ownership and service life expectations.

The rated endurance of up to 100 mating cycles indicates the mechanical durability of the connector’s contact interfaces and physical locking mechanisms. This parameter emerges from standardized test procedures that simulate repeated insertion and extraction events, measuring contact resistance drift, mechanical wear, and retention force degradation. Engineering assessment should consider this durability relative to the expected operational and maintenance profiles of the end equipment. In applications where frequent connect/disconnect actions occur—such as in modular instrumentation setups or test environments—this rating guides the selection process to ensure sustainable connector performance without premature failure. Conversely, fixed-installation systems with infrequent mating cycles might prioritize other parameters, such as corrosion resistance or current rating, over endurance.

Taken collectively, these electrical performance parameters frame a profile appropriate for connectors operating at moderate power levels where reliable current carrying capacity, insulation integrity, and signal quality coexist with mechanical robustness for occasional mating cycles. The interplay of material choice, test standards, and application environment informs the engineering judgments necessary for specifying the ATP15-2P-BM02GRY in system designs that balance performance requirements with cost-efficiency and operational longevity.

Material Composition and Environmental Ratings of ATP15-2P-BM02GRY

The selection of materials and environmental ratings for the ATP15-2P-BM02GRY connector reflect a comprehensive approach to reliability, durability, and functional performance under challenging operational conditions. Understanding the interplay between material composition, mechanical design, and environmental resistance is critical for engineers and technical professionals when specifying connectors for automotive, industrial, and telecommunications applications where exposure to temperature extremes, mechanical stresses, and contaminant ingress is a common concern.

Contacts fabricated from copper alloys form the electrical interface within the connector, leveraging copper’s inherent combination of electrical conductivity, mechanical strength, and corrosion resistance. The copper alloy substrate is optimized to balance conductivity with structural robustness, reducing the risk of contact deformation or fretting corrosion during repeated mating cycles or vibration exposure. The choice of plating material atop the copper alloy—specifically gold or tin—addresses distinct performance trade-offs. Gold plating, typically applied at a minimum thickness of 3.2 microinches, offers superior oxidation resistance and maintains low contact resistance over extended service periods, which is particularly valuable in low-current signal or data transmission pathways where consistent electrical integrity is paramount. Tin plating, while less costly, provides adequate conductivity and wear resistance in environments subject to less aggressive oxidation but may require consideration of the potential for tin whisker growth in sensitive electronics contexts. The specified plating thickness also plays a role in contact reliability, as thinner layers may degrade more rapidly under mechanical abrasion or corrosion, influencing long-term connector life cycles.

The connector housing uses a thermoplastic material formulated to endure a wide temperature range extending from -55°C to +125°C. This temperature envelope corresponds with service conditions typically encountered in automotive underhood compartments, industrial machinery with temperature cycling, and outdoor telecommunications installations. Thermoplastics selected must exhibit stable mechanical properties such as tensile strength and dimensional integrity across this temperature range, ensuring that the connector maintains sealing performance and mechanical retention. Furthermore, the polymer resin requires resistance to common automotive fluids, UV exposure (in outdoor deployments), and potential chemical contaminants, which influences the choice of additives, fillers, and stabilizers in the molding compound. The thermoplastic’s dielectric properties are also crucial for ensuring signal integrity and minimizing dielectric losses or cross-talk in multi-pin configurations.

Integrated sealing elements made from silicone rubber contribute significantly to the connector’s environmental resistance by providing a compressive interface that prevents particulate ingress and moisture penetration up to IP67 standards when mated. IP67 certification implies full protection against dust ingress (denoted by the '6') and immersion in water up to 1 meter depth for 30 minutes (denoted by the '7'). Silicone rubber seals offer elasticity and recovery characteristics over a broad temperature range consistent with the housing material, ensuring persistent seal compression despite thermal expansion/contraction cycles or mechanical shock. The seal material also exhibits resistance to degradation from ozone, UV radiation, and automotive fluids, which preserves functional performance over extended field use. In practical selection scenarios, the presence of integrated seals certified to IP67 influences system design decisions by reducing the need for additional external sealing measures, thus minimizing assembly complexity and potential failure points.

Evaluating this connector’s material properties and environmental ratings within application contexts involves several trade-off considerations. For example, applications requiring consistent low-level signal transmission in corrosive or high-vibration environments may justify the cost premium of gold-plated copper contacts to mitigate contact resistance variability and mechanical wear. Conversely, systems with primarily power interconnections or less severe environmental exposure might prioritize tin plating to optimize cost without compromising performance beyond design margins. Similarly, the connector’s temperature rating accommodates use cases spanning cold-start automotive environments to high-temperature industrial enclosures, guiding engineers in thermal management and housing integration strategies. The integrated silicone seal’s performance facilitates deployment in moisture-exposed conditions common in agricultural equipment, outdoor sensors, or industrial automation, informing enclosure design and ingress protection planning.

By analyzing the synergy between contact metallurgy, plating characteristics, thermoplastic housing properties, and seal performance, professionals gain insight into how these factors collectively determine connector function and longevity in intended operating environments. This understanding assists in aligning connector selection with electrical performance demands, mechanical durability requirements, and environmental exposure profiles, thus supporting informed decisions in product development, procurement, and system integration.

Mounting, Termination, and Compatibility Features of ATP15-2P-BM02GRY

The ATP15-2P-BM02GRY connector integrates specific mechanical mounting, electrical termination, and system compatibility features tailored to meet practical engineering demands in panel-mounted electronic applications. Examining these aspects in detail clarifies the design intentions, performance considerations, and integration constraints relevant to engineers and technical procurement specialists.

The mechanical attachment of the ATP15-2P-BM02GRY uses a flange panel-mount architecture. This design implies that the connector is installed through an appropriately dimensioned cutout on a flat panel surface, and thereafter fixed in place via thread-forming screws. The use of thread-forming screws rather than conventional machine screws facilitates reliable, reusable fastening into metal or plastic panel frames without pre-tapped holes, lowering assembly complexity and cost. From an engineering standpoint, the thread-forming fastening method generates helical mating threads by displacing panel material, creating a strong mechanical anchor point with optimized thread engagement. The screw torque must be carefully controlled within manufacturer-specified limits; excessive torque risks deformation of the connector flange or panel damage, whereas insufficient torque may result in inadequate retention and potential loosening under vibration or thermal cycling. Applications involving dynamic mechanical environments or elevated temperatures benefit from this mounting approach by providing stable, vibration-resistant fixation that maintains electrical continuity and connector alignment over time.

Termination is specified as through-hole soldering onto printed circuit boards (PCBs). Through-hole plating inherently delivers superior mechanical retention compared to surface mount counterparts by allowing component leads to pass fully through holes plated with conductive metal layers, enabling solder joints around the entire lead circumference. This results in enhanced mechanical robustness against pull forces, critical in connectors subjected to frequent mating cycles or mechanical stress. The compatibility with standard PCB assembly processes ensures straightforward integration into conventional wave solder or selective soldering lines without requiring retooling or specialized soldering protocols. However, through-hole termination implies larger PCB real estate consumption compared to surface-mount designs, influencing board layout considerations in high-density environments. The thermal mass of connector leads also impacts soldering temperature profiles, which must be carefully managed to prevent PCB damage or incomplete solder fillets.

Compatibility within system architectures is governed by the ATP15-2P-BM02GRY’s membership in the BoardLock connector series. This categorization is significant because it defines mechanical and electrical mating interfaces standardized for cross-component interchangeability. Specifically, the ATP15-2P-BM02GRY mates with the ATP06-2S series plug connectors, ensuring system designers can select complementary mating halves optimized for targeted current ratings, contact materials, or environmental seals while maintaining overall connector form factor consistency. The latch geometry and pin configurations of both connectors are engineered to achieve reliable engagement force and low insertion/extraction forces to balance ease of assembly with secure connection. For system integration, this compatibility affects procurement planning and maintenance logistics, streamlining parts inventory and enabling replacement without redesigning interconnection infrastructure.

The connector’s four-wall shrouded housing structure embodies multiple engineering functions. Primarily, the shroud acts as a mechanical guard that protects the internal contacts from physical damage during handling and assembly, particularly in confined or obstructed workspaces. Secondly, the shroud provides polarization through asymmetric wall geometries or keyed features that prevent incorrect mating orientation. This design mitigates the risk of reversed or misaligned connector insertion, which can cause intermittent connections, electrical shorts, or equipment damage. In manufacturing processes involving high-volume or repetitive assembly steps, the reduction of manual error through physical polarization aids in maintaining consistent product quality and reduces rework or warranty failures. As a side effect, the shroud also contributes to electromagnetic compatibility by partially shielding the mating interface, although full EMI shielding would require additional design measures.

Engineers selecting the ATP15-2P-BM02GRY must consider the interplay between its mechanical retention strategy, termination approach, and mating compatibility features in context of their specific application environment. For instance, applications subject to mechanical vibration may prioritize the flange mounting and thread-forming screw method to avoid connector loosening. Conversely, designs constrained by PCB area or requiring surface-mount assembly techniques may find through-hole termination less optimal despite its mechanical advantages. The necessity for BoardLock series compatibility imposes constraints on connector ecosystem selection, necessitating evaluation of complementary plug options to maintain system coherence. Furthermore, the shrouded design’s effect on assembly error reduction must be weighed against any spatial limitations introduced by the connector footprint. Understanding these feature-specific trade-offs enables targeted specification decisions that align with performance expectations, manufacturing capabilities, and long-term maintenance considerations.

Variants and Customization Options within the ATP15-2P-BM0XXXX Series

The ATP15-2P-BM0XXXX series encompasses connector components designed with multiple variants that focus on adaptability to diverse operational requirements through strategic modifications in plating, potting, and visual identification. Understanding these configuration options is essential for professionals engaged in electrical system design, product selection, and procurement, where environmental conditions, mechanical durability, and electrical performance intersect.

Variants within this series differentiate primarily in three technical aspects: plating materials, potting encapsulation, and housing coloration. Plating material selection influences corrosion resistance, electrical conductivity, and solderability. Typical plating choices, such as tin, nickel, or gold finishes, impact contact resistance and long-term reliability based on the connector’s exposure to humidity, oxidation-prone atmospheres, or mechanical wear. For example, gold plating provides lower contact resistance and superior resistance to corrosion but at increased cost and potential galvanic considerations when mated with specific counterpart materials. Nickel plating offers robust mechanical protection with moderate conductivity and cost-effectiveness, while tin plating can optimize solderability but is more susceptible to creep corrosion in harsh environments.

Potting presence and formulation serve as a critical factor in enhancing environmental sealing and mechanical resilience. The ATP15-2P-BM0XXXX variants offer options with and without potting encapsulation. Potting—using polymeric materials to fill the connector cavities—forms a barrier against ingress of moisture, dust, and chemical agents. The encapsulated variants are engineered to withstand internal pressures up to approximately 5 PSI, indicating suitability for applications with mild pressurized environments or where enhanced sealing against liquid infiltration is mandated. This pressure rating suggests that potting material selection and application technique are optimized to uphold connector integrity without compromising contact functionality. Applications involving automotive engine compartments, HVAC controls, or industrial automation often benefit from such designs where condensation, particulate exposure, or incidental fluid contact occur. Conversely, unpotted connectors may be preferable in applications where ventilation, thermal dissipation, or future maintenance access outweigh sealing requirements.

Housing color-coding, manifested in gray or black variants, provides a pragmatic method for identification and differentiation within complex assembly environments. Color assignment can correlate to voltage ratings, circuit function, or mating series compatibility, facilitating error mitigation during manufacturing or maintenance workflows. From an engineering viewpoint, housing colors could also reflect differences in polymeric compound formulations adapted to specific flame retardancy standards, UV resistance, or mechanical toughness, although these parameters should be corroborated against detailed datasheet specifications rather than assumed.

This modular configurability approach within the ATP15-2P-BM0XXXX family enables users to align connector selection precisely with environmental exposure profiles, expected current loads, and assembly constraints. For example, in industrial control panels exposed to intermittent high humidity and mechanical vibration, a potted connector with nickel or gold plating and a black housing can enhance lifespan and contact stability. By contrast, applications in indoor electronic equipment with minimal environmental stress might prioritize unpotted, tin-plated versions with gray housings to optimize cost and serviceability.

Trade-offs in these selections often revolve around balancing cost, reliability, and manufacturability. Potting introduces additional process steps and curing times during assembly, potentially affecting throughput. Similarly, plating choices can influence solder joint quality and soldering parameter adjustments, necessitating coordination between design and manufacturing teams. Awareness of the interplay between plating materials and mating contacts under different current densities is vital to preclude accelerated wear or fretting corrosion, phenomena that degrade signal or power integrity over time.

Evaluation of these variants should integrate application-specific criteria such as exposure to pressure differentials, contamination risks, electrical load profiles, and maintenance schedules. The presence of potting within the ATP15-2P-BM0XXXX variants reflects a design strategy catering to enhanced sealing without excessively complicating assembly or compromising electrical parameters. Similarly, plating and housing options extend configurability for fine-tuning performance versus cost metrics. Engineers and product selectors can leverage these layered design features to make informed decisions that reflect operational demands and lifecycle expectations, aligning material properties and construction techniques with system-level performance targets.

Application Considerations and Use Cases for ATP15-2P-BM02GRY

The ATP15-2P-BM02GRY connector series is engineered to address the technical requirements of board-to-cable interconnections that demand moderate current handling, environmental sealing, and mechanical reliability. Understanding its suitability for specific applications involves analyzing its fundamental design parameters, environmental robustness, electrical characteristics, mechanical integration features, and typical usage scenarios relevant to telecommunications, industrial, and automotive sectors.

The core electrical parameter of this connector lies in its moderate current rating, dictated by contact size, conductor cross-section, and material conductivity. The two-pin configuration (2P) supports signal or power levels that do not exceed the connector’s maximum current capacity, which is a critical consideration to prevent overheating, contact degradation, or voltage drop in operation. Engineers selecting this component must correlate expected load currents and transient conditions with manufacturer specifications to ensure compliance with safe operating limits. The moderate current specification positions this connector away from high-current industrial power applications but suitable for control signals, sensor lines, and auxiliary power circuits.

A significant engineering characteristic is the IP67 sealing rating, attained through design features such as elastomeric gaskets, precisely machined mating surfaces, and a secure locking mechanism. This rating implies the connector can maintain reliable electrical continuity and physical integrity when subjected to immersion in water up to 1 meter for 30 minutes and is completely protected against ingress of dust particles. The structural design that achieves this involves careful material selection resistant to corrosion and dimensional stability under temperature cycling. This environmental sealing becomes a decisive factor for applications exposed to rain, wash-down processes, dust-infused atmospheres, or temporary submersion, common in outdoor telecommunications enclosures, industrial automation cabinets, and automotive engine compartments.

The operating temperature range designated for this connector influences material choices such as thermoplastic insulators, contact plating, and sealing gaskets. These materials are required to maintain mechanical flexibility and electrical insulation properties across the specified temperature window, typically encompassing -40°C to +85°C or higher for automotive-grade components. Understanding the thermal behavior helps engineers anticipate performance degradation modes like contact resistance increase or gasket hardening, influencing long-term reliability. The connector’s durability under multiple mating cycles, often quantified in specifications as several hundred to a few thousand mating/unmating operations, is tied to contact plating hardness and mechanical design tolerances. This parameter impacts maintenance planning and connector lifecycle assessment in service environments where repeated disconnection may be necessary.

The flange mount configuration addresses challenges related to mechanical retention and panel integration. By distributing mounting forces over a larger surface area through flanges and securing screws, the connector ensures stable assembly that resists vibration and mechanical shock. This mounting style is pertinent where limited enclosure space exists but a rigid, sealed interface must be maintained, preventing damage due to connector movement or panel flexing. In contexts such as PLC control panels or outdoor communication cabinets, mounting considerations also interact with thermal expansion coefficients of the surrounding materials, influencing sealing consistency and mechanical stress distribution.

Standardized pitch and form factor present design efficiencies by aligning with existing PCB layouts that employ common connector dimensions and pin spacing standards. This compatibility reduces layout iteration cycles, enables modular system designs, and supports parts interchangeability in manufacturing and repair. The pitch, typically measured in millimeters, correlates directly with the conductor cross-sectional area and contact pitch, balancing current-carrying capacity and space constraints on the PCB. Such standardization is a practical approach in overcoming integration challenges, ensuring the connector does not impose unnecessary mechanical or electrical redesigns.

Application analysis reveals that the ATP15-2P-BM02GRY connector finds use in outdoor telecommunications equipment where exposure to harsh weather and intermittent submersion requires sealing against dust and water ingress, combined with stable electrical performance. In industrial control panels, the connector’s durability under repeated mating cycles supports routine maintenance operations while its IP67 rating addresses dust and occasional liquid splashes. Automotive electronics interfaces benefit from the moderate temperature range and mechanical robustness essential for under-hood or chassis-mounted sensor connections, where vibrations and temperature variations are prevalent.

Trade-offs inherent in selecting this connector include balancing sealing performance against size constraints, as achieving IP67 requires additional gasket materials and secure mating mechanisms that increase connector bulk relative to non-sealed counterparts. Likewise, the moderate current rating precludes use in high-power applications, guiding system architects to pair this connector only with circuits within its electrical limits. These design decisions are typically influenced by system-level priorities such as space optimization, reliability under environmental stress, and ease of assembly/disassembly.

Potential misconceptions may arise regarding sealing ratings, where users might assume permanent water immersion compatibility beyond the specified limits or underestimate degradation due to repeated mechanical wear on sealing elements. Engineering judgment suggests integrating routine inspection schedules in maintenance plans and considering connector replacement at defined mating cycle thresholds to avoid reliability lapses.

In practice, selecting the ATP15-2P-BM02GRY entails thorough assessment of electrical load demands, environmental exposure profiles, mechanical integration constraints, and maintenance cycles. Attention to contact resistance specifications, abrasion resistance of mating surfaces, and thermal aging profiles provides predictive insights for long-term performance. These considerations assist engineers and procurement specialists in aligning connector selection with specific application demands, optimizing system reliability while streamlining design and production processes.

Conclusion

The Amphenol ATP15-2P-BM02GRY connector represents a specific implementation within the ATP15 series, characterized by a precise combination of mechanical, electrical, and environmental attributes tailored for industrial, automotive, and communication system applications. To understand its suitability and guide selection decisions, it is necessary to examine the connector’s fundamental design principles, construction parameters, and performance trade-offs relative to operational demands commonly encountered in these sectors.

At the structural level, the ATP15-2P-BM02GRY utilizes a two-pin configuration within a compact housing designed to support secure and reliable mating cycles. The mechanical robustness stems from its shell and contact materials, which typically include engineered metal alloys and plated conductors optimized for wear resistance, corrosion protection, and consistent contact force. The connector’s locking mechanism integrates a bayonet or threaded coupling system, which influences assembly ease and mechanical retention under vibration or shock conditions. Understanding the interplay between these mechanical design choices and the mounting strategy illustrates how installation practices can impact connection integrity during maintenance or high-vibration environments.

From an electrical perspective, contact geometry and material composition determine conductivity, current-carrying capacity, and signal integrity. The two-pin arrangement focuses on power or signal transmission with specific current ratings—often in the range aligned with mid-level industrial signal or low-voltage power applications. Contact resistance values and dielectric properties influence both efficiency and electromagnetic compatibility (EMC), with the connector’s design targeting minimized insertion loss and stable impedance. This is particularly relevant in communication system deployments requiring noise suppression and predictable signal transmission.

Environmental sealing is achieved by integrating gasket materials and precise tolerances to resist ingress of moisture, dust, and corrosive agents. The connector typically complies with IP67 or similar ingress protection ratings, indicating full dust-tight construction and immersion capability under specified conditions. These parameters are critical when selecting connectors for outdoor or harsh industrial environments, where exposure to contaminants could degrade electrical performance or cause mechanical failure over time. The choice of sealing compounds and housing design reflects a compromise between ease of assembly, repeatability of sealing performance, and long-term durability under thermal cycling or vibration.

Variants within the ATP15 series offer compatibility options such as differing mounting orientations (panel mount, cable mount), pin arrangements, and shell finishes, enabling configurability to match application-specific constraints like spatial limitations, wiring scheme diversity, or environmental conditions. This variant ecosystem supports modular design approaches, where standard connector footprints facilitate system upgrades or replacements without extensive re-engineering, conserving costs and reducing downtime.

In practical engineering evaluations, the ATP15-2P-BM02GRY’s performance must be contextualized by the operating environment’s electrical load characteristics, mechanical stressors, and maintenance regimes. For example, systems subjected to frequent mating cycles demand connectors with gold-plated contacts and robust locking to preserve low contact resistance over time. Conversely, static installations may prioritize sealing integrity and corrosion resistance. Also, the balance between connector size and current rating involves trade-offs; compact connectors reduce system volume but may constrain thermal dissipation, thereby limiting peak current.

Considering these factors collectively informs a decision-making process that aligns connector selection with system reliability targets, operational longevity, and installation complexity. Engineers and procurement specialists benefit from examining the ATP15-2P-BM02GRY’s datasheet specifications, testing certifications (such as UL or IEC standards compliance), and application notes illustrating performance under simulated real-world stressors. This data-driven approach aids in aligning component capabilities with expected service conditions, thereby avoiding over-specification or under-provisioning that could lead to added cost or premature failure.

In summary, the ATP15-2P-BM02GRY connector integrates a defined set of design features that reflect common engineering requirements for rugged, electrically stable, and environmentally sealed connections. Its structural and material choices, along with variant adaptability, mirror practical considerations in industrial and automotive system design, supporting dependable integration across varied deployment scenarios.

Frequently Asked Questions (FAQ)

Q1. What are the current and voltage ratings of the ATP15-2P-BM02GRY connector?

A1. The ATP15-2P-BM02GRY connector is designed to handle continuous currents up to 25 amperes, establishing its suitability for moderate power distribution or control signal applications. Its dielectric withstand voltage rating supports operation at AC voltages up to 1500 V, which limits leakage currents to less than 2 milliamps under test conditions. This parameter ensures sufficient insulation resistance between contacts and housing, reducing risk of dielectric breakdown or unintended conduction, and meeting common industrial safety margins.

Q2. What materials are used in the contacts and housing of the ATP15-2P-BM02GRY?

A2. Contact elements consist of a copper alloy substrate chosen for its favorable balance between electrical conductivity and mechanical strength. To mitigate surface oxidation and maintain low contact resistance, these contacts receive plating with either tin or gold at thicknesses exceeding 3.2 microinches. Gold plating provides superior corrosion resistance and stable, low-resistance interfaces, critical in high-reliability or low-voltage signaling contexts. The housing is fabricated from thermoplastic engineered to retain mechanical integrity and dielectric properties over an extended thermal range from -55°C to +125°C, suitable for harsh environments. Silicone rubber seals complement the housing, selected for elasticity and resilience to environmental factors, enabling ingress protection against dust and moisture.

Q3. How does the sealing performance of the ATP15-2P-BM02GRY affect its applications?

A3. Achieving an IP67 ingress protection rating when mated, the sealed design excludes dust particles and resists water immersion up to 1 meter depth for 30 minutes. This capability relies on tight mechanical tolerances, silicone rubber gaskets sealing mating interfaces, and robust housing construction. Such sealing supports deployment in outdoor, industrial, or transportation environments where exposure to contaminants or transient submersion occurs. However, the sealing performance is contingent on correct assembly and maintaining connector interface integrity, since damage to seals or improper mating can degrade IP rating adherence.

Q4. What mounting hardware is recommended for the ATP15-2P-BM02GRY and how is torque controlled?

A4. The connector flange mounting relies on thread-forming screws, specifically M3.63 x 4 mm fasteners, selected to negotiate durable threads within the mounting substrate while providing mechanical retention. The recommended tightening torque range spans 11 to 15 in-lbs (1.24–1.70 Nm), establishing sufficient preload to maintain mechanical stability and vibration resistance without causing material deformation or housing damage. Torque management addresses challenges such as ensuring flat flange contact, avoiding screw loosening under mechanical and thermal cycling, and facilitating repeatable field installations. Use of calibrated torque tools is standard practice to manage these parameters effectively.

Q5. How many mating cycles can the ATP15-2P-BM02GRY withstand?

A5. The connector is qualified for at least 100 mating cycles, reflecting material and plating durability plus mechanical design optimization to resist wear on contact surfaces and housing features. This level suits scenarios involving maintenance or replacement frequencies consistent with industrial connectors in field or test applications. Beyond specified cycles, increased insertion forces or rising contact resistance could manifest due to surface degradation or plastic deformation, underscoring the importance of monitoring cycle counts in reliability-critical systems.

Q6. Are there different variants of the ATP15-2P-BM0XXXX series in terms of plating and potting?

A6. The series offers variants featuring either gold or tin plating on contacts, accommodating differing application requirements for corrosion resistance, cost constraints, or signal integrity needs. Additionally, some models incorporate potting compounds within the connector body to improve environmental sealing and mechanical ruggedness. The potting enhances pressure resistance to levels up to 5 PSI, facilitating use in pressurized or fluid exposure contexts. Housing color options such as gray and black may assist in system-level identification or conform to aesthetic and compatibility standards in OEM applications.

Q7. What are the pitch and dimensional details relevant for PCB design with this connector?

A7. The nominal pin pitch is 0.264 inches (6.71 mm), spacing designed to balance compactness with effective insulation distances to meet voltage clearance requirements. Height from PCB mounting plane to insulation top measures approximately 34.0 mm, influencing enclosure design and clearance planning. The two-position configuration with a straight flange mount is optimized for through-hole PCB implementations, facilitating reliable solder joints and mechanical attachment. These dimensions must inform PCB footprint layout, drill pattern precision, and nearby component placement to avoid mechanical interference and accommodate assembly tooling.

Q8. Which mating part fits with the ATP15-2P-BM02GRY in a system assembly?

A8. The ATP15-2P-BM02GRY mates with counterparts from the ATP06-2S series, designed as complementary wire-to-board connectors. This pairing ensures consistent mechanical engagement, proper electrical continuity, and retention forces suitable for typical system applications. The mating interface includes features for polarization and alignment, reducing assembly errors and ensuring contact integrity. Selecting the correct mating part prevents compatibility issues that could degrade performance or compromise sealing.

Q9. How does the connector’s shrouded design influence assembly and durability?

A9. Employing a four-wall shroud surrounding the contacts achieves multiple engineering objectives: mechanical protection against impact or abrasion during handling, minimization of accidental shorting or damage to contact elements, and enforcement of correct polarization to prevent mismating. By integrating physical barriers and keying features, the shroud design contributes to reduced assembly errors and supports long-term reliability. Additionally, this structural approach moderates the insertion force distribution, lowering stress concentration on contacts to mitigate deformation or material fatigue over repeated cycles.

Q10. What environmental temperatures can the ATP15-2P-BM02GRY operate within without degradation?

A10. The connector's operating temperature range spans from -55°C up to +125°C. This thermal envelope accommodates deployment in applications experiencing extreme temperature fluctuations, including outdoor exposure, industrial automation, and certain vehicular environments. Material selections for both the housing and conductive elements maintain electrical, mechanical, and sealing performance across this range. Notably, extended exposure to temperatures near the maximum rating requires consideration of potential polymer aging effects and the mechanical stress imparted by thermal expansion mismatches within assembled systems.

Q11. Is the ATP15-2P-BM02GRY compliant with any environmental standards?

A11. Conformance with RoHS directives signifies that the ATP15-2P-BM02GRY avoids hazardous substances such as lead, mercury, cadmium, and certain brominated flame retardants above regulated thresholds. Compliance supports integration into products targeting global markets with environmental safety regulations, as well as alignment with corporate sustainability goals. Verification of RoHS status typically involves supplier documentation and certifications relevant to material sourcing and manufacturing processes.

Q12. Can the ATP15-2P-BM02GRY be used in applications requiring pressure sealing?

A12. Variants of the connector featuring potting compounds are engineered to withstand pressure differentials up to approximately 5 PSI (pounds per square inch), enhancing sealing against fluid ingress under moderate pressure conditions. This capability broadens application viability to include environments with transient pressure exposure, such as sealed enclosures subject to altitude changes or water ingress at shallow depths. However, pressure sealing performance depends on maintaining potting integrity and correct assembly procedures to ensure no inadvertent paths for leakage emerge.

Q13. What is the recommended contact finish for high-reliability applications?

A13. Gold plating on contact surfaces is generally advised when prioritizing low contact resistance, consistency over time, and enhanced corrosion resistance, especially in environments with exposure to humidity, oxidizing agents, or low current signals where contact resistance changes can impact system performance. Although gold plating involves higher cost premiums relative to tin, the trade-off often justifies its selection in aerospace, medical, or high-precision instrumentation applications. The plating thickness and uniformity also influence durability and must meet defined standards to achieve intended reliability outcomes.

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Catalog

1. Product Overview of Amphenol ATP15-2P-BM02GRY2. Mechanical Design and Physical Characteristics of ATP15-2P-BM02GRY3. Electrical Performance Parameters of ATP15-2P-BM02GRY4. Material Composition and Environmental Ratings of ATP15-2P-BM02GRY5. Mounting, Termination, and Compatibility Features of ATP15-2P-BM02GRY6. Variants and Customization Options within the ATP15-2P-BM0XXXX Series7. Application Considerations and Use Cases for ATP15-2P-BM02GRY8. Conclusion

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