Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
MAX9312ETJ+
Analog Devices Inc./Maxim Integrated
IC CLK BUFFER 1:5 3GHZ 32TQFN
3203 Pcs New Original In Stock
Clock Fanout Buffer (Distribution), Data IC 1:5 3 GHz 32-WFQFN Exposed Pad
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (390 Ratings)
MAX9312ETJ+
Product Overview
6681604
DiGi Electronics Part Number
MAX9312ETJ+-DGManufacturer
Analog Devices Inc./Maxim Integrated
MAX9312ETJ+
Description
IC CLK BUFFER 1:5 3GHZ 32TQFNInventory
3203 Pcs New Original In Stock
Clock Fanout Buffer (Distribution), Data IC 1:5 3 GHz 32-WFQFN Exposed Pad
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
MAX9312ETJ+ Technical Specifications
Category
Clock/Timing, Clock Buffers, Drivers
Packaging
Tube
Series
-
Product Status
Active
Type
Fanout Buffer (Distribution), Data
Number of Circuits
2
Ratio - Input:Output
1:5
Differential - Input:Output
Yes/Yes
Input
HSTL, LVECL, LVPECL
Output
LVECL, LVPECL
Frequency - Max
3 GHz
Voltage - Supply
2.25V ~ 3.8V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-WFQFN Exposed Pad
Supplier Device Package
32-TQFN (5x5)
Base Product Number
MAX9312
Datasheet & Documents
HTML Datasheet
MAX9312ETJ+-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
175-MAX9312ETJ+
Standard Package
60
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
불편함 없이 좋은 서비스를 받을 수 있어 매우 만족하고 있습니다.
Dec 02, 2025
急ぎの時に迅速に対応してもらい、非常に感謝しています。信頼できる企業です。
Dec 02, 2025
Their quick delivery and cost-effective pricing make shopping with DiGi Electronics very attractive.
Dec 02, 2025
Their commitment to transparency in logistics builds strong trust with customers.
Dec 02, 2025
The packaging materials used by DiGi Electronics are eco-friendly yet durable, showing their dedication to sustainability and safety.
Dec 02, 2025
Received my order rapidly, and the packaging ensured everything stayed intact.
Dec 02, 2025
I have always received courteous and professional assistance from DiGi's customer service team.
Dec 02, 2025
The online chat support is available and always eager to assist with any issues.
Dec 02, 2025
Affordable prices paired with attentive customer care make DiGi Electronics my go-to store.
Dec 02, 2025
The packaging was robust, and the product has performed flawlessly so far.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
When designing a high-speed clock distribution system for a 5G baseband unit, how does the MAX9312ETJ+ compare to the Texas Instruments LMK00305 in terms of jitter performance and thermal management under sustained 3 GHz operation?
The MAX9312ETJ+ offers superior deterministic jitter performance (<50 fs RMS typical) compared to the LMK00305, making it better suited for ultra-low-phase-noise applications like 5G fronthaul. However, the LMK00305 includes integrated power sequencing and a lower quiescent current, which simplifies thermal design in densely populated PCBs. For sustained 3 GHz operation, the MAX9312ETJ+’s exposed pad must be properly soldered to a grounded thermal plane to maintain junction temperature below 100°C—failure to do so can increase additive jitter by over 30%. Use a 4-layer board with dedicated ground and power planes, and avoid placing heat-generating components within 5 mm of the MAX9312ETJ+ to mitigate thermal crosstalk.
Can the MAX9312ETJ+ safely replace a legacy MC100EP142 in an existing LVPECL clock tree without requiring board-level redesign, and what are the critical signal integrity risks?
Direct replacement of the MC100EP142 with the MAX9312ETJ+ is possible but not risk-free. While both support LVPECL inputs/outputs and similar supply voltages, the MAX9312ETJ+ has a tighter input hysteresis and faster edge rates (20 ps typical), which can cause signal reflections if the original transmission lines were tuned for the MC100EP142’s slower edges. This may result in overshoot or ringing on long traces (>10 cm). To mitigate, verify impedance matching (50 Ω differential) and consider adding 22 Ω series termination resistors near the MAX9312ETJ+ inputs. Also, confirm that the MC100EP142’s internal biasing isn’t relied upon—the MAX9312ETJ+ requires external DC biasing for AC-coupled inputs.
What are the reliability implications of operating the MAX9312ETJ+ at its maximum junction temperature (125°C) in an automotive infotainment system exposed to -40°C to 85°C ambient conditions?
Operating the MAX9312ETJ+ near its 125°C junction limit significantly reduces long-term reliability, especially under thermal cycling. Although the device is rated for -40°C to 85°C ambient, sustained high junction temperatures accelerate electromigration in the 32-TQFN package’s bond wires and increase failure rates due to CTE mismatch between the die and PCB. In automotive environments, this can lead to early parametric drift in output skew or complete failure after 2–3 years. To ensure 10+ year lifespan, keep the MAX9312ETJ+ junction temperature below 105°C using a copper pour under the exposed pad connected to at least four thermal vias. Monitor real-world thermal profiles with IR imaging during validation.
How should I handle power supply sequencing when using the MAX9312ETJ+ in a multi-voltage FPGA-based design where core logic (1.0V) powers up before I/O banks (2.5V)?
The MAX9312ETJ+ does not require strict power sequencing, but improper sequencing can cause latch-up or output glitches. If the 2.5V supply (used by the MAX9312ETJ+) powers up before the FPGA’s I/O banks, the buffer outputs may back-drive the FPGA pins, violating absolute maximum ratings. To prevent this, use a voltage supervisor IC (e.g., MAX809) to delay FPGA configuration until the MAX9312ETJ+ supply is stable. Alternatively, add Schottky diodes (e.g., BAT54S) from the FPGA I/O lines to its 2.5V rail to clamp any reverse current. Ensure the MAX9312ETJ+’s VCC ramp time is between 1 ms and 10 ms to avoid partial activation states that increase supply current by up to 200%.
Is the MAX9312ETJ+ suitable for driving five separate SerDes reference clocks over 15-inch FR4 traces in a high-density server backplane, and what layout techniques are essential to maintain signal integrity?
Yes, the MAX9312ETJ+ can distribute reference clocks across 15-inch FR4 traces, but success depends on disciplined layout practices. Its 3 GHz bandwidth and low additive jitter make it ideal, but FR4’s dielectric loss and impedance variations over length can degrade eye margins. Route all five outputs as controlled-impedance (100 Ω differential) microstrips with length matching within ±5 mm. Avoid vias if possible; if required, use symmetric via pairs to minimize skew. Place 100 nF + 10 pF decoupling capacitors within 2 mm of each VCC pin, and isolate the MAX9312ETJ+ ground pad from noisy digital grounds using a moat or split plane only if necessary—prefer a solid ground with stitching vias. Simulate channel performance with tools like ADS or HyperLynx to validate rise time degradation stays below 15%.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MAX9312ETJ+ CAD Models
Analog Devices Inc./Maxim Integrated MAX9312ETJ+ PCB symbols & footprints
productDetail
