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93LC46BT-I/MC
Microchip Technology
IC EEPROM 1KBIT MICROWIRE 8DFN
4712 Pcs New Original In Stock
EEPROM Memory IC 1Kbit Microwire 2 MHz 8-DFN (2x3)
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93LC46BT-I/MC
Product Overview
1234760
DiGi Electronics Part Number
93LC46BT-I/MC-DGManufacturer
Microchip Technology
93LC46BT-I/MC
Description
IC EEPROM 1KBIT MICROWIRE 8DFNInventory
4712 Pcs New Original In Stock
EEPROM Memory IC 1Kbit Microwire 2 MHz 8-DFN (2x3)
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1
Minimum 1
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93LC46BT-I/MC Technical Specifications
Category
Memory, Memory
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
DiGi-Electronics Programmable
Verified
Memory Type
Non-Volatile
Memory Format
EEPROM
Technology
EEPROM
Memory Size
1Kbit
Memory Organization
64 x 16
Memory Interface
Microwire
Clock Frequency
2 MHz
Write Cycle Time - Word, Page
6ms
Voltage - Supply
2.5V ~ 5.5V
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
8-VFDFN Exposed Pad
Supplier Device Package
8-DFN (2x3)
Base Product Number
93LC46
Datasheet & Documents
HTML Datasheet
93LC46BT-I/MC-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.32.0051
Additional Information
Other Names
93LC46BT-I/MCDKR
93LC46BT-I/MCCT
93LC46BTIMC
93LC46BT-I/MC-DG
93LC46BT-I/MCTR
Standard Package
3,300
Alternative Parts
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Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
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Dec 02, 2025
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Dec 02, 2025
The friendly team at DiGi Electronics always makes me feel like a valued customer.
Dec 02, 2025
We value their consistent quality and the dedicated support team that stands behind their products.
Dec 02, 2025
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Dec 02, 2025
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the 93LC46BT-I/MC in a low-power embedded system with intermittent power supply?
When integrating the 93LC46BT-I/MC into a low-power system with unstable power, the primary risk is incomplete write cycles due to sudden power loss, which can corrupt data. This EEPROM has a 6ms write cycle time that must complete uninterrupted. To mitigate this, ensure the MCU holds the device in reset or disables the Microwire clock during power-down, and consider using a small backup capacitor to sustain supply long enough to complete writes. Also, implement firmware-level write validation and avoid random-address writes without confirming completion via polling or delay timing.
How does the 93LC46BT-I/MC compare to the AT93C46DY6-YH-T in terms of compatibility and reliability for drop-in replacement in an existing DFN-8 footprint?
The 93LC46BT-I/MC and AT93C46DY6-YH-T share similar 1Kbit 64x16 organization and Microwire interface, but key differences exist. The Microchip 93LC46BT-I/MC specifies tighter write timing control and operates across a wider voltage range (2.5V–5.5V) versus the Adesto part's typical 2.7V minimum, which may cause issues at 3.0V or lower. Also, the 93LC46BT-I/MC offers better ESD protection and higher endurance (1M cycles vs 100K), making it more reliable in industrial environments. Always verify command set compatibility—some Adesto variants use different opcodes—so firmware may require updates even if pinouts match.
Can the 93LC46BT-I/MC reliably operate at the full 2 MHz Microwire clock frequency in noisy automotive environments with long trace lengths?
Operating the 93LC46BT-I/MC at 2 MHz in electrically noisy environments risks data corruption due to signal integrity issues, especially with trace lengths over 10 cm. The 8-DFN (2x3) package has minimal parasitics, but Microwire is unidirectional and lacks robust error checking. To ensure reliability, use controlled impedance traces, minimize stubs, add series termination resistors (22–33Ω) near the driver, and shield clock and data lines if routed near switching components. For harsh automotive applications, derate clock speed to 1 MHz and validate timing margins over temperature and voltage extremes.
What are the thermal considerations when placing the 93LC46BT-I/MC near high-power components on a densely packed PCB?
The 93LC46BT-I/MC uses an 8-DFN (2x3) package with an exposed thermal pad that must be properly soldered to a ground plane for thermal dissipation and mechanical stability. When placed near high-power ICs or MOSFETs, localized board temperatures can exceed the rated 85°C ambient, reducing data retention lifetime and increasing write failure risk. To mitigate, maintain at least 3 mm clearance from heat sources, use thermal vias under the exposed pad, and consider local airflow or thermal reliefs in routing. Simulate thermal performance under maximum load to ensure junction temperature stays below 105°C.
What PCB layout and handling precautions are critical for the 93LC46BT-I/MC given its MSL 3 rating and small DFN footprint?
The 93LC46BT-I/MC's 8-DFN (2x3) package with exposed pad and MSL 3 (168-hour floor life) requires strict handling and assembly controls. Before reflow, store in dry packaging or a dry cabinet; if exposed over 168 hours in >30°C/60%RH, bake at 125°C for 24 hours. For layout, ensure the thermal pad has an array of 2x2 thermal vias (0.3 mm drill) connected to internal ground layers, and avoid via-in-pad unless filled. Use solder paste stencil apertures with 0.3–0.4 mm reduced thickness for pins to prevent bridging, and inspect post-reflow with X-ray for voiding under the pad.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
93LC46BT-I/MC CAD Models
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