Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
PIC12F519T-I/MC
Microchip Technology
IC MCU 8BIT 1.5KB FLASH 8DFN
3581 Pcs New Original In Stock
PIC PIC® 12F Microcontroller IC 8-Bit 8MHz 1.5KB (1K x 12) FLASH 8-DFN (2x3)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (204 Ratings)
PIC12F519T-I/MC
Product Overview
1320649
DiGi Electronics Part Number
PIC12F519T-I/MC-DGManufacturer
Microchip Technology
PIC12F519T-I/MC
Description
IC MCU 8BIT 1.5KB FLASH 8DFNInventory
3581 Pcs New Original In Stock
PIC PIC® 12F Microcontroller IC 8-Bit 8MHz 1.5KB (1K x 12) FLASH 8-DFN (2x3)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
PIC12F519T-I/MC Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
PIC® 12F
Product Status
Active
DiGi-Electronics Programmable
Verified
Core Processor
PIC
Core Size
8-Bit
Speed
8MHz
Connectivity
-
Peripherals
POR, WDT
Number of I/O
5
Program Memory Size
1.5KB (1K x 12)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
41 x 8
Voltage - Supply (Vcc/Vdd)
2V ~ 5.5V
Data Converters
-
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
8-DFN (2x3)
Package / Case
8-VFDFN Exposed Pad
Base Product Number
PIC12F519
Datasheet & Documents
HTML Datasheet
PIC12F519T-I/MC-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
PIC12F519T-I/MCTR
PIC12F519T-I/MCDKR
PIC12F519T-I/MCCT
Standard Package
3,300
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
물류 추적 서비스가 매우 신뢰할 수 있어서 걱정 없이 배송을 맡길 수 있었습니다.
Dec 02, 2025
他們的配送非常迅速，訂單處理速度也很快，讓我非常滿意。
Dec 02, 2025
Das Team ist professionell, hilfsbereit und sorgt für schnelle Lösungen.
Dec 02, 2025
I have complete confidence in DiGi Electronics' products because of their rigorous quality standards.
Dec 02, 2025
The quick response from after-sales team gave me confidence in their service quality.
Dec 02, 2025
The site layout adapts perfectly to my device, ensuring a consistent experience.
Dec 02, 2025
Their support team is proactive and always available to assist.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
What are the key design-in risks when using the PIC12F519T-I/MC in a low-power battery application, and how can they be mitigated?
A critical design-in risk with the PIC12F519T-I/MC in battery-powered systems is unintentional current drain due to improper I/O configuration or unmanaged sleep modes. Since the device lacks deep sleep peripherals and has limited RAM retention options, engineers must ensure all five I/O pins are set to defined logic states before entering Sleep mode to avoid floating inputs drawing leakage current. Additionally, the internal oscillator's wake-up behavior should be validated under low Vdd conditions (down to 2V) to prevent failed wake-ups. Mitigate these risks by enabling the Watchdog Timer (WDT) as a fail-safe wake-up source, using internal pull-ups where applicable, and verifying current consumption (<200 nA typical) in final firmware with real-world PCB assembly—accounting for board-level leakage paths.
Can the PIC12F519T-I/MC replace a PIC10F200 in an existing design, and what PCB and firmware changes should be expected?
Yes, the PIC12F519T-I/MC can serve as a functional upgrade path from the PIC10F200, offering 1.5KB program memory versus 512 words and improved OTP yield, but key differences require design revisions. The PIC12F519T-I/MC uses a DFN (2x3mm) package versus the PIC10F200’s SOT-23, requiring a PCB re-layout for the 8-DFN with exposed thermal pad. Firmware changes include adapting to different OSCCAL calibration addressing and confirming timing loops are recalibrated due to 8MHz internal oscillator tolerance (±1% to ±2% over temperature). Also, verify I/O pin remapping since the PIC12F519T-I/MC uses GP0–GP5 versus GP0–GP3 on the PIC10F200. Use Microchip’s Migration App Note TB3149 to align configuration bits and memory maps.
How does the limited I/O count of the PIC12F519T-I/MC impact sensor interface design in space-constrained applications?
The PIC12F519T-I/MC provides only five general-purpose I/O pins, which constrains direct interfacing with multiple digital sensors. In space-limited designs, engineers face trade-offs between signal routing, power control, and communication lines. A common risk is overloading the I/O by omitting level-shifting or ESD protection on shared lines. To maximize utility, use time-multiplexed control schemes—such as driving a low-side FET with one GPIO while reading a sensor on another—and implement bidirectional sensing where input/output functions are dynamically reassigned. Avoid using ICs requiring dedicated enable, clock, and data lines unless bit-banging protocols like 1-Wire or Manchester encoding are feasible. Consider pin conflict during reset and MCLR configuration (shared with GP3) to prevent false triggers during power-up.
What thermal and electrical reliability concerns arise when using the PIC12F519T-I/MC in high-temperature industrial environments?
While the PIC12F519T-I/MC is rated for operation up to 85°C ambient, real-world thermal challenges include self-heating in the 8-DFN (2x3) package, especially with multiple I/Os switching at high drive strength. At elevated temperatures, parametric shifts in oscillator frequency and flash endurance become critical—write cycles should be minimized even though the datasheet allows limited calibration storage techniques. The exposed pad must be properly soldered to a grounded PCB thermal plane to ensure reliable heat dissipation and mechanical integrity. Avoid designs where Vdd rises slowly near 2V, as brown-out conditions may trigger erratic execution before POR stabilizes. For industrial reliability, enable the WDT in software and validate operation with marginally low Vdd and high junction temperature using worst-case timing analysis.
How does the PIC12F519T-I/MC compare to the ATTINY5 in terms of firmware development and toolchain support for rapid prototyping?
The PIC12F519T-I/MC and ATTINY5 both target ultra-small 8-bit applications, but differ significantly in toolchain accessibility. The PIC12F519T-I/MC requires Microchip MPLAB X IDE and PICkit 3/4 for programming, with limited C compiler support due to Harvard architecture constraints, whereas the ATTINY5 integrates smoothly with Arduino-like workflows via Atmel Studio and AVR-GCC. Engineers choosing the PIC12F519T-I/MC should expect longer development cycles due to assembly-heavy coding practices and fewer community code examples. However, the PIC offers better long-term supply assurance and AEC-Q100-compatibility options. For rapid prototyping, use the DIP socket adapter with PICkit 4 and leverage Microchip’s Code Configurator for bit manipulation and WDT/POR setup to reduce firmware debug time.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
PIC12F519T-I/MC CAD Models
Microchip Technology PIC12F519T-I/MC PCB symbols & footprints
productDetail
