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DSPB56364AF100
NXP USA Inc.
IC DSP 24BIT AUD 100MHZ 100-LQFP
2432 Pcs New Original In Stock
Embedded, Integrated Circuits (ICs)
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5.0 / 5.0
- (305 Ratings)
DSPB56364AF100
Product Overview
7193508
DiGi Electronics Part Number
DSPB56364AF100-DGManufacturer
NXP USA Inc.
DSPB56364AF100
Description
IC DSP 24BIT AUD 100MHZ 100-LQFPInventory
2432 Pcs New Original In Stock
Embedded, Integrated Circuits (ICs)
Quantity
Minimum 1
Minimum 1
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DSPB56364AF100 Technical Specifications
Category
Embedded, DSP (Digital Signal Processors)
Packaging
-
Series
DSP56K/Symphony
Product Status
Obsolete
Type
Audio Processor
Interface
Host Interface, I2C, SAI, SPI
Clock Rate
100MHz
Non-Volatile Memory
ROM (24kB)
On-Chip RAM
11.25kB
Voltage - I/O
3.30V
Voltage - Core
3.30V
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Surface Mount
Package / Case
100-LQFP
Supplier Device Package
100-LQFP (14x14)
Base Product Number
DSPB56
Datasheet & Documents
HTML Datasheet
DSPB56364AF100-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Standard Package
900
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
The price advantage is clear, and the packaging quality ensures my products arrive intact.
Dec 02, 2025
Thanks to their efficient shipping, I received my order much sooner than anticipated.
Dec 02, 2025
Fast delivery combined with friendly, professional support—perfect!
Dec 02, 2025
Their affordable prices mean I can buy more without worry.
Dec 02, 2025
The speed of delivery was remarkable, and the packaging was thoughtfully designed.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the DSPB56364AF100 in a new audio processing system given its obsolete status?
Using the DSPB56364AF100 in new designs carries significant supply chain and long-term support risks due to its obsolete status from NXP USA Inc. While 2346 units are currently available as new original stock, future availability is not guaranteed, which can jeopardize production scalability and end-of-life management. Engineers should assess lifetime buy requirements and consider designing with drop-in replacements or pin-compatible successors like the DSP56364AVF108 where possible, or evaluate NXP's newer audio DSPs such as the MSC81xx series with migration support. Mitigate risk by securing long-term supply agreements and maintaining backward-compatible firmware modules for easier future migration.
How does the 3.3V core and I/O voltage of the DSPB56364AF100 impact system-level power design in mixed-voltage audio applications?
The DSPB56364AF100 requires a stable 3.3V supply for both core and I/O, which can complicate integration in modern mixed-signal systems using lower-voltage MCUs (e.g., 1.8V or 2.5V). Direct interfacing with lower-voltage peripherals risks overvoltage damage or signal contention. Use bidirectional level shifters for interfaces like I2C, SPI, and Host Interface, especially when connecting to newer codecs or microcontrollers such as the STM32L4 series. Also ensure low-noise LDO regulation to avoid digital switching noise degrading audio signal integrity, particularly critical in high-fidelity applications using the SAI interface.
Can the DSPB56364AF100 replace the ADSP-21364 from Analog Devices in professional audio platforms without major firmware changes?
Replacing the ADSP-21364 with the DSPB56364AF100 is not a direct drop-in replacement due to architectural differences: the DSPB56364AF100 is based on NXP's DSP56K core, while the ADSP-21364 uses Analog Devices' SHARC architecture, resulting in incompatible instruction sets and memory maps. Firmware rewrites, toolchain migration (from VisualDSP++ to NXP's CodeWarrior or S32DS), and peripheral register reconfiguration are required. While both support 24-bit audio and similar interfaces (SAI vs. S/PDIF), expect significant effort in algorithm porting and real-time performance validation due to differing cache structures and interrupt handling models.
What thermal and PCB layout considerations are critical when integrating the DSPB56364AF100 in a high-density surface-mount audio module?
The 100-LQFP (14x14mm) package of the DSPB56364AF100 requires careful thermal management in high-density layouts. The MSL-3 rating (168 hours floor life) demands strict humidity control during assembly; bake the device if exposed beyond limit. Use a thermal pad connection to a solid ground plane with multiple vias to dissipate heat, especially under sustained 100MHz operation. Maintain 50-ohm impedance for clock and SAI traces, and route analog and digital grounds separately with a single-point connection to minimize noise coupling. Avoid placing large BGAs nearby to prevent rework challenges due to LQFP's fine-pitch leads.
How does the on-chip memory (24kB ROM, 11.25kB RAM) limit real-time audio algorithm performance in the DSPB56364AF100, and what are the workarounds?
The DSPB56364AF100's limited on-chip RAM (11.25kB) can constrain complex real-time audio processing such as multi-band dynamics, FIR filtering, or effects stacking, increasing reliance on external memory and risking bottlenecks. Use on-chip ROM for fixed coefficients (e.g., filter taps) to preserve RAM. Optimize code density via NXP's assembly-level directives and partition data across fast X and Y memory spaces. If external memory is used, ensure bus timing aligns with the 100MHz clock to avoid wait states. Consider algorithmic simplifications or multi-buffering strategies to maintain consistent latency, especially in I2C- or SPI-controlled feedback loops.
Quality Assurance (QC)
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DSPB56364AF100 CAD Models
NXP USA Inc. DSPB56364AF100 PCB symbols & footprints
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