NVMFS6H864NLT1G >
NVMFS6H864NLT1G
onsemi
MOSFET N-CH 80V 7A/22A 5DFN
2569 Pcs New Original In Stock
N-Channel 80 V 7A (Ta), 22A (Tc) 3.5W (Ta), 33W (Tc) Surface Mount 5-DFN (5x6) (8-SOFL)
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NVMFS6H864NLT1G onsemi
5.0 / 5.0 - (460 Ratings)

NVMFS6H864NLT1G

Product Overview

12968583

DiGi Electronics Part Number

NVMFS6H864NLT1G-DG

Manufacturer

onsemi
NVMFS6H864NLT1G

Description

MOSFET N-CH 80V 7A/22A 5DFN

Inventory

2569 Pcs New Original In Stock
N-Channel 80 V 7A (Ta), 22A (Tc) 3.5W (Ta), 33W (Tc) Surface Mount 5-DFN (5x6) (8-SOFL)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 0.8572 0.8572
  • 10 0.6987 6.9870
  • 30 0.6194 18.5820
  • 100 0.5401 54.0100
  • 500 0.4932 246.6000
  • 1500 0.4697 704.5500
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NVMFS6H864NLT1G Technical Specifications

Category Transistors, FETs, MOSFETs, Single FETs, MOSFETs

Manufacturer onsemi

Packaging Tape & Reel (TR)

Series -

Product Status Active

FET Type N-Channel

Technology MOSFET (Metal Oxide)

Drain to Source Voltage (Vdss) 80 V

Current - Continuous Drain (Id) @ 25°C 7A (Ta), 22A (Tc)

Drive Voltage (Max Rds On, Min Rds On) 4.5V, 10V

Rds On (Max) @ Id, Vgs 29mOhm @ 5A, 10V

Vgs(th) (Max) @ Id 2V @ 20µA

Gate Charge (Qg) (Max) @ Vgs 9 nC @ 10 V

Vgs (Max) ±20V

Input Capacitance (Ciss) (Max) @ Vds 431 pF @ 40 V

FET Feature -

Power Dissipation (Max) 3.5W (Ta), 33W (Tc)

Operating Temperature -55°C ~ 175°C (TJ)

Grade Automotive

Qualification AEC-Q101

Mounting Type Surface Mount

Supplier Device Package 5-DFN (5x6) (8-SOFL)

Package / Case 8-PowerTDFN, 5 Leads

Base Product Number NVMFS6

Datasheet & Documents

HTML Datasheet

NVMFS6H864NLT1G-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.29.0095

Additional Information

Other Names
488-NVMFS6H864NLT1GDKR
488-NVMFS6H864NLT1GTR
488-NVMFS6H864NLT1GCT
Standard Package
1,500

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
NTMFS6H864NLT1G
onsemi
4359
NTMFS6H864NLT1G-DG
0.2787
Parametric Equivalent
RS6N120BHTB1
Rohm Semiconductor
2621
RS6N120BHTB1-DG
0.4224
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5.0/5.0-(Show up to 5 Ratings)
바람***는길
Dec 02, 2025
5.0
고객 센터가 정말 친절했고, 배송도 빠르게 왔어요.
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Dec 02, 2025
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Ich fühle mich bei DiGi Electronics als Kunde geschätzt und gut betreut.
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Frequently Asked Questions (FAQ)

Can I use the NVMFS6H864NLT1G as a drop-in replacement for the NTMFS6H864NLT1G in an existing automotive power management design, and what are the key layout or thermal considerations I should verify before doing so?

Yes, the NVMFS6H864NLT1G can generally serve as a drop-in replacement for the NTMFS6H864NLT1G due to nearly identical electrical characteristics, package footprint (5-DFN 5x6), and AEC-Q101 qualification. However, you must verify that your PCB thermal pad design matches the exposed metal tab configuration and that your solder reflow profile accommodates both parts’ MSL 1 rating. Pay special attention to gate drive compatibility—both require 10V for full enhancement—and ensure your layout minimizes loop inductance, especially in high-di/dt switching applications. A thermal simulation under worst-case ambient conditions is recommended to confirm junction temperature stays within limits given the 33W (Tc) dissipation spec assumes ideal heatsinking.

What are the real-world reliability risks when operating the NVMFS6H864NLT1G near its 22A continuous drain current limit in a compact EV auxiliary converter, and how can I mitigate them?

Operating the NVMFS6H864NLT1G at or near its 22A rating (specified at case temperature Tc = 25°C) without proper thermal management significantly increases risk of thermal runaway and premature failure. In practice, this current level is only achievable with aggressive heatsinking—typically a large copper pour or direct attachment to a cold plate. At elevated ambient temperatures (common in EV under-hood environments), derating is essential; aim to keep Tj below 150°C even under transient overloads. Use thermal vias under the package, monitor case temperature via embedded sensors, and consider parallel devices if sustained high-current operation is required. Also, ensure your gate driver can maintain Vgs ≥ 10V under all conditions to minimize Rds(on) and conduction losses.

How does the NVMFS6H864NLT1G compare to the RS6N120BHTB1 from Rohm in terms of switching performance and EMI behavior for a 48V mild-hybrid inverter application?

The NVMFS6H864NLT1G offers lower gate charge (9nC max @ 10V vs. ~14nC for RS6N120BHTB1), enabling faster switching and reduced gate drive losses—advantageous in high-frequency 48V systems. However, its lower input capacitance (431pF vs. ~600pF) means higher dv/dt during turn-off, which can exacerbate EMI if not properly managed with snubbers or gate resistors. The onsemi part also has slightly lower Rds(on) (29mΩ vs. ~35mΩ), improving efficiency under light loads. For EMI-sensitive automotive applications, you may need to add a small gate resistor (2–10Ω) to control slew rate when using the NVMFS6H864NLT1G, whereas the RS6N120BHTB1’s inherently slower switching might reduce filtering complexity but increase conduction losses.

Is the NVMFS6H864NLT1G suitable for hot-swap or inrush current control circuits in automotive battery systems, and what design precautions are necessary to avoid failure during repeated plug-in events?

The NVMFS6H864NLT1G can be used in hot-swap applications, but its 80V Vdss rating leaves minimal margin in 48V systems where load-dump transients can exceed 70V. To ensure reliability, implement active voltage clamping (e.g., TVS diodes) and use a dedicated hot-swap controller to manage inrush via soft-start gate control. Repeated plug-in events cause thermal cycling; mitigate this by oversizing the copper area under the package and avoiding operation near the 22A limit during startup. Also, verify that your gate drive circuit maintains sufficient Vgs during brownout conditions—insufficient drive increases Rds(on), leading to localized heating and potential SOA violation during capacitive charging.

What are the critical layout mistakes to avoid when designing a high-current PCB with the NVMFS6H864NLT1G in a 5-DFN package, especially regarding thermal performance and parasitic inductance?

Common layout errors include insufficient thermal vias under the exposed pad, long source traces increasing parasitic inductance, and asymmetric gate routing causing uneven switching. For optimal thermal performance, use at least nine 0.3mm thermal vias connected to an internal ground/power plane acting as a heat spreader. Keep the drain and source loops as short and wide as possible—preferably using adjacent layers with coplanar stitching vias—to minimize inductance that can cause voltage overshoot and ringing. Route the gate signal away from high-dv/dt nodes and use a low-impedance driver close to the device. Avoid placing sensitive analog traces beneath the MOSFET, as switching noise can couple through the substrate. Following these practices ensures the NVMFS6H864NLT1G operates within its safe operating area and leverages its full 33W (Tc) power capability.

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