AM26C32CDBR >
AM26C32CDBR
Texas Instruments
IC RECEIVER 0/4 16SSOP
3130 Pcs New Original In Stock
0/4 Receiver RS422, RS423 16-SSOP
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AM26C32CDBR Texas Instruments
5.0 / 5.0 - (395 Ratings)

AM26C32CDBR

Product Overview

1263065

DiGi Electronics Part Number

AM26C32CDBR-DG

Manufacturer

Texas Instruments
AM26C32CDBR

Description

IC RECEIVER 0/4 16SSOP

Inventory

3130 Pcs New Original In Stock
0/4 Receiver RS422, RS423 16-SSOP
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Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 1.6630 1.6630
  • 10 1.6218 16.2180
  • 30 1.5948 47.8440
  • 100 1.5679 156.7900
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AM26C32CDBR Technical Specifications

Category Interface, Drivers, Receivers, Transceivers

Manufacturer Texas Instruments

Packaging Tape & Reel (TR)

Series -

Product Status Last Time Buy

Type Receiver

Protocol RS422, RS423

Number of Drivers/Receivers 0/4

Duplex -

Receiver Hysteresis 60 mV

Data Rate -

Voltage - Supply 4.5V ~ 5.5V

Operating Temperature 0°C ~ 70°C (TA)

Mounting Type Surface Mount

Package / Case 16-SSOP (0.209", 5.30mm Width)

Supplier Device Package 16-SSOP

Base Product Number AM26C32

Datasheet & Documents

Manufacturer Product Page

AM26C32CDBR Specifications

HTML Datasheet

AM26C32CDBR-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Standard Package
2,000

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
AM26C32IDBR
Texas Instruments
3046
AM26C32IDBR-DG
0.8740
MFR Recommended

Reviews

5.0/5.0-(Show up to 5 Ratings)
Feuil***eVert
Dec 02, 2025
5.0
Je recommande DiGi Electronics pour ses tarifs doux et ses initiatives écologiques remarquables.
Lu***ily
Dec 02, 2025
5.0
Packaging was professional and meticulous, showing real care in presentation and protection.
Shi***rSky
Dec 02, 2025
5.0
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Frequently Asked Questions (FAQ)

Can the AM26C32CDBR be used in a new design as a direct replacement for the AM26C32IDBR, and are there any thermal or ESD reliability risks I should consider?

Yes, the AM26C32CDBR can be used as a direct replacement for the AM26C32IDBR in new designs—it shares the same pinout, protocol support (RS422/RS423), and supply voltage range (4.5V–5.5V). However, while both are rated for 0°C to 70°C, the 'C' variant (AM26C32CDBR) lacks the industrial temperature grade of the 'I' variant, meaning it is less suitable for environments with temperature extremes or thermal cycling. For long-term reliability, ensure adequate board-level ESD protection on receiver lines, as the AM26C32CDBR has no built-in transient protection. Use series resistors and TVS diodes on all differential inputs in electrically noisy environments to prevent latent damage.

What are the main design-in risks when using the AM26C32CDBR in a high-noise industrial RS422 network with long cable runs?

When using the AM26C32CDBR in high-noise environments with long RS422 cables, the primary risks include signal integrity degradation and false triggering due to ground differentials. Although the device includes 60 mV receiver hysteresis to improve noise immunity, unbalanced cable impedance or poor shielding can still induce errors. Mitigate this by using twisted-pair, shielded cables with proper grounding at one end only, and ensure termination resistors (typically 120Ω) are installed at the receiver end. Avoid star topologies—use point-to-point or daisy-chain configurations. Also verify that common-mode voltage stays within the -7V to +12V range; exceeding this may damage inputs or cause data corruption.

Is the AM26C32CDBR suitable for use in a 3.3V system with level shifting, and what are the signal integrity trade-offs?

The AM26C32CDBR requires a 4.5V–5.5V supply and cannot be powered directly from a 3.3V rail, making it unsuitable for native 3.3V systems without careful level shifting. While you can use bidirectional voltage translators for the control lines (e.g., EN), the high-speed differential RS422 signals must remain on the 5V domain. This means you cannot simply translate the RX lines—instead, you must maintain a 5V power domain for the AM26C32CDBR. This increases design complexity and board space. Additionally, mixing 3.3V logic with 5V-powered peripherals increases risk of latch-up if voltage sequencing isn't controlled. Use separate power planes and ensure 5V is stable before enabling control signals.

How does the end-of-life status (Last Time Buy) of the AM26C32CDBR impact long-term production, and what are the most viable replacement options?

The AM26C32CDBR's 'Last Time Buy' status means Texas Instruments is discontinuing the part, posing a supply chain risk for long-term or high-volume production. Once current inventory (3095 pcs) is depleted, future sourcing will rely on third-party suppliers with increased cost and counterfeit risk. Consider redesigning with active-pin-compatible alternatives such as the SN75LVCP27 (TI), which supports 3.3V operation and offers similar RS422 receiver functionality with higher data rates and better ESD protection. If maintaining 5V logic is essential, evaluate the MAX3086E from Maxim Integrated for drop-in compatibility and improved thermal performance. Start sample testing replacements early to validate signal integrity and timing margins.

What are the PCB layout best practices for the 16-SSOP package of the AM26C32CDBR to ensure signal integrity and thermal reliability in dense surface-mount designs?

For reliable operation of the AM26C32CDBR in the 16-SSOP package, follow key PCB layout practices: Maintain a solid ground plane beneath the device to reduce noise coupling and improve heat dissipation. Route differential pairs (A/B inputs) with matched trace lengths and 100Ω differential impedance to prevent skew and EMI. Avoid sharp 90° bends and vias in high-speed paths. Keep the device away from switching power components to reduce ground bounce. Use thermal reliefs on power and ground pads for manufacturability, but ensure sufficient copper connectivity for thermal performance. Due to the SSOP footprint's fine pitch (0.65mm), adhere to IPC standards for stencil design and reflow profiles to prevent solder bridging. Verify MSL1 rating allows for one-time reflow, but minimize board rework to prevent moisture ingress risks.

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