CD74HC595M96 >
CD74HC595M96
Texas Instruments
IC SHIFT REGISTER 8-BIT 16-SOIC
1632 Pcs New Original In Stock
Shift Shift Register 1 Element 8 Bit 16-SOIC
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CD74HC595M96 Texas Instruments
5.0 / 5.0 - (62 Ratings)

CD74HC595M96

Product Overview

1260577

DiGi Electronics Part Number

CD74HC595M96-DG

Manufacturer

Texas Instruments
CD74HC595M96

Description

IC SHIFT REGISTER 8-BIT 16-SOIC

Inventory

1632 Pcs New Original In Stock
Shift Shift Register 1 Element 8 Bit 16-SOIC
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Minimum 1

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  • 1 0.2959 0.2959
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CD74HC595M96 Technical Specifications

Category Logic, Shift Registers

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series 74HC

Product Status Active

Logic Type Shift Register

Output Type Tri-State

Number of Elements 1

Number of Bits per Element 8

Function Serial to Parallel, Serial

Voltage - Supply 2V ~ 6V

Operating Temperature -55°C ~ 125°C

Mounting Type Surface Mount

Package / Case 16-SOIC (0.154", 3.90mm Width)

Supplier Device Package 16-SOIC

Base Product Number 74HC595

Datasheet & Documents

HTML Datasheet

CD74HC595M96-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
CD74HC595M96E4-DG
-CD74HC595M96G4-NDR
-CD74HC595M96-NDR
296-18402-6
296-18402-1
-CD74HC595M96E4-NDR
-CD74HC595M96G4
296-18402-2
-CD74HC595M96E4
CD74HC595M96G4
CD74HC595M96E4
-296-18402-1-DG
CD74HC595M96G4-DG
-296-18402-1
Standard Package
2,500

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
CD74HC595M
Texas Instruments
1590
CD74HC595M-DG
0.0030
Direct
MC74HC595ADR2G
onsemi
505111
MC74HC595ADR2G-DG
0.0030
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MM74HC595SJ
onsemi
962
MM74HC595SJ-DG
0.0030
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74HC595D,112
Nexperia USA Inc.
1191
74HC595D,112-DG
0.0030
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CD74HC595MT
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956
CD74HC595MT-DG
0.0030
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
Wort***derer
Dec 02, 2025
5.0
Der Kundenservice hat mich bei Problemen stets freundlich und prompt unterstützt.
Golde***ssamer
Dec 02, 2025
5.0
Their quick response to inquiries helps me meet my urgent deadlines.
Hap***low
Dec 02, 2025
5.0
DiGi Electronics provides excellent after-service, making me a loyal customer.
Gol***Dawn
Dec 02, 2025
5.0
My order arrived ahead of schedule, thanks to their efficient logistics network.
Radia***Realm
Dec 02, 2025
5.0
Shipping packaging is robust; I’ve never received any damaged components thanks to their careful handling.
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Frequently Asked Questions (FAQ)

Can the CD74HC595M96 be safely used to drive high-brightness LEDs directly without current-limiting resistors, and what are the risks if I skip them in a 5V system?

No, the CD74HC595M96 should never drive high-brightness LEDs directly without current-limiting resistors. While its output pins can source or sink up to 35 mA (absolute maximum), typical LED forward currents often exceed safe operating limits, especially for white or blue LEDs that may require 20–30 mA at 5V. Without resistors, you risk exceeding the per-pin or total package current limits (e.g., 70 mA max per pin, 150 mA total for all outputs combined), leading to thermal runaway, output degradation, or permanent damage. Always use series resistors calculated based on VCC, LED forward voltage, and desired current to ensure reliability and compliance with the CD74HC595M96’s safe operating area.

Is the CD74HC595M96 a drop-in replacement for the NXP 74HC595D in a 3.3V design, and what timing or noise issues should I anticipate during migration?

The CD74HC595M96 is electrically compatible with the NXP 74HC595D in most 3.3V applications due to shared 74HC logic thresholds and timing specs, but subtle differences in propagation delay (t_PD) and output transition times may affect high-speed designs. At 3.3V, both support full functionality, but the TI version may exhibit slightly faster edge rates, potentially increasing ground bounce or EMI in dense PCB layouts. Verify setup/hold times with your microcontroller—especially if clocking above 10 MHz—and consider adding decoupling capacitors (100 nF per IC) near VCC to mitigate noise. Always validate timing margins in your actual system before full deployment.

How does the CD74HC595M96 behave under voltage brownout conditions between 2V and 4.5V, and can it maintain register state during brief power dips in battery-powered applications?

The CD74HC595M96 will not reliably maintain register state during voltage brownouts below ~4V, even though its specified supply range starts at 2V. Below 4.5V, internal logic thresholds degrade, and flip-flop states become unpredictable—especially during transitions. In battery-powered systems (e.g., Li-ion dropping to 3.3V under load), this can cause unintended output glitches or data corruption. To mitigate risk, implement a power supervisor IC to disable shifting during undervoltage events or use non-volatile alternatives like shift registers with EEPROM backup. Never assume state retention; always reinitialize the CD74HC595M96 after any supply interruption.

Can I cascade more than eight CD74HC595M96 devices on a single SPI bus without signal integrity issues, and what layout practices are critical for reliable operation at 20 MHz?

Yes, you can cascade multiple CD74HC595M96 devices, but beyond eight stages (64 outputs), signal degradation becomes likely at 20 MHz due to cumulative propagation delay (~13 ns per stage typ.) and capacitive loading on shared clock/data lines. Total delay can exceed one clock period, violating setup times. To maintain reliability: use series termination resistors (22–33 Ω) on clock and data lines, minimize trace lengths, avoid stubs, and place decoupling caps within 5 mm of each IC. For >8 devices, consider buffering the clock line with a 74HC125 or reducing clock speed. Always simulate or prototype the full chain to validate timing margins.

What are the long-term reliability risks of using the CD74HC595M96 in an industrial environment with frequent thermal cycling between -40°C and 110°C, despite its rated -55°C to 125°C range?

Although the CD74HC595M96 is rated for -55°C to 125°C, frequent thermal cycling in industrial environments can induce mechanical stress on the 16-SOIC package leads and bond wires, potentially leading to solder joint fatigue or intermittent connections over time—especially if PCB CTE mismatch exists. Additionally, leakage currents increase near temperature extremes, which may affect tri-state bus contention in shared-line designs. Mitigate risk by using conformal coating to reduce moisture-induced corrosion, ensuring proper reflow profiling during assembly, and avoiding mechanical stress near the package. For mission-critical applications, consider automotive-grade alternatives (e.g., SN74HC595QPWREP) with enhanced qualification, even if the CD74HC595M96 appears functionally adequate.

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