DS90UB913ATRTVRQ1 >
DS90UB913ATRTVRQ1
Texas Instruments
IC SER/DES 10-100MHZ FPD 32WQFN
29390 Pcs New Original In Stock
1.4Gbps Serializer 12 Input 1 Output 32-WQFN (5x5)
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DS90UB913ATRTVRQ1 Texas Instruments
5.0 / 5.0 - (86 Ratings)

DS90UB913ATRTVRQ1

Product Overview

1326928

DiGi Electronics Part Number

DS90UB913ATRTVRQ1-DG

Manufacturer

Texas Instruments
DS90UB913ATRTVRQ1

Description

IC SER/DES 10-100MHZ FPD 32WQFN

Inventory

29390 Pcs New Original In Stock
1.4Gbps Serializer 12 Input 1 Output 32-WQFN (5x5)
Quantity
Minimum 1

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In Stock (All prices are in USD)
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  • 1 4.2152 4.2152
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DS90UB913ATRTVRQ1 Technical Specifications

Category Interface, Serializers, Deserializers

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Active

Function Serializer

Data Rate 1.4Gbps

Input Type LVCMOS

Output Type FPD-Link III, LVDS

Number of Inputs 12

Number of Outputs 1

Voltage - Supply 1.71V ~ 1.89V, 3V ~ 3.6V

Operating Temperature -40°C ~ 105°C (TA)

Grade Automotive

Qualification AEC-Q100

Mounting Type Surface Mount

Package / Case 32-WFQFN Exposed Pad

Supplier Device Package 32-WQFN (5x5)

Base Product Number DS90UB913

Datasheet & Documents

Manufacturer Product Page

DS90UB913ATRTVRQ1 Specifications

HTML Datasheet

DS90UB913ATRTVRQ1-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991B1
HTSUS 8542.39.0001

Additional Information

Other Names
296-46295-6
296-46295-1
296-46295-2
DS90UB913ATRTVRQ1-DG
Standard Package
1,000

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
DS90UB913ATRTVJQ1
Texas Instruments
7971
DS90UB913ATRTVJQ1-DG
0.0422
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
바***밀
Dec 02, 2025
5.0
구매 후 후속 서비스도 훌륭했고, 배송 과정도 투명하게 관리되어 매우 만족스러웠어요.
하***야기
Dec 02, 2025
5.0
지불 과정이 간편하고 직관적이어서 1분 만에 결제를 완료했어요.
青***長流
Dec 02, 2025
5.0
我買的電子元件,不僅運送迅速,使用後發現它們的耐久性超出預期,在長期運作下仍然穩定。
Rise***Shine
Dec 02, 2025
5.0
They provide comprehensive support even after the purchase.
Radi***eFlow
Dec 02, 2025
5.0
The packaging quality from DiGi Electronics always impresses me—robust and reliable.
Vel***Glow
Dec 02, 2025
5.0
Lightning fast shipping combined with secure packaging made the process smooth.
Happ***rbor
Dec 02, 2025
5.0
The high-quality materials used in their products give me confidence in their longevity.
Sunr***Magic
Dec 02, 2025
5.0
The diverse product range at DiGi Electronics keeps me engaged and satisfied.
Swee***rmony
Dec 02, 2025
5.0
Their products demonstrate excellent durability at a very reasonable price.
Ligh***dLove
Dec 02, 2025
5.0
The broad product diversity at DiGi Electronics satisfies all my tech needs.
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Frequently Asked Questions (FAQ)

Can the DS90UB913ATRTVRQ1 be safely replaced with a DS90UB914A-Q1 in a camera-to-processor link design without firmware changes?

No, the DS90UB913ATRTVRQ1 (serializer) and DS90UB914A-Q1 (deserializer) are complementary devices and cannot be directly substituted for one another. Even if pin-compatible in some packages, the DS90UB913ATRTVRQ1 lacks the deserialization logic required on the receiving end. Replacing it with a deserializer would break the signal chain. Always ensure serializer-deserializer pairs match in family and configuration—using mismatched parts risks protocol incompatibility, loss of control data, and failure to lock the FPD-Link III channel.

What are the key risks when designing a PCB with the DS90UB913ATRTVRQ1 in a high-vibration automotive environment, and how can layout mitigate them?

The DS90UB913ATRTVRQ1’s 32-WQFN exposed pad package is susceptible to mechanical stress and thermal cycling in automotive applications. Inadequate solder joint integrity under vibration can cause intermittent LVDS output or power delivery faults. Mitigate this by using a full-array ground plane under the exposed pad, applying thermal vias (≥12 vias, 0.3mm diameter), and following TI’s recommended land pattern with NSMD pads. Additionally, avoid routing high-speed traces near board edges or stress points to prevent microcracks that degrade 1.4Gbps signal integrity.

How does the DS90UB913ATRTVRQ1 compare to the Maxim MAX9286 in terms of EMI performance for ADAS camera systems, and what design trade-offs should I consider?

The DS90UB913ATRTVRQ1 uses embedded clock FPD-Link III with spread-spectrum signaling, which typically offers better EMI suppression than the MAX9286’s parallel LVDS output approach. However, the MAX9286 integrates a deserializer, reducing BOM count if you need both functions. If your system already includes a separate deserializer (e.g., DS90UB914A-Q1), the DS90UB913ATRTVRQ1 provides superior noise resilience over long cables. Trade-offs include higher power (due to dual voltage rails) and stricter impedance control requirements—maintain 100Ω differential impedance on FPD-Link III traces within ±10% to avoid reflections at 1.4Gbps.

Is it safe to operate the DS90UB913ATRTVRQ1 at 105°C ambient temperature continuously, and what derating practices should be applied for long-term reliability?

While the DS90UB913ATRTVRQ1 is AEC-Q100 qualified for -40°C to +105°C ambient operation, continuous operation at the upper limit accelerates electromigration and reduces MTBF. TI recommends derating junction temperature below 125°C; at 105°C ambient, ensure adequate airflow or thermal relief to keep Tj < 115°C. Monitor power dissipation—especially during high-data-rate bursts—and consider lowering the core voltage toward 1.71V (within spec) to reduce heat. Also, validate long-term reliability with thermal cycling tests per AEC-Q100-004, as solder joint fatigue increases near Tj max.

What happens if I accidentally apply 3.3V to the 1.8V core supply pin (VDD_IO) on the DS90UB913ATRTVRQ1, and how can I protect against such miswiring in production?

Applying 3.3V to the 1.8V VDD_IO rail of the DS90UB913ATRTVRQ1 will likely cause immediate damage due to oxide breakdown in the core logic, leading to latent failures or complete device malfunction. To prevent this, implement hardware interlocks such as a voltage supervisor IC (e.g., TPS3839) that disables power sequencing if rails are out of order, or use a PMIC with built-in rail monitoring. Additionally, label connectors clearly and consider using keyed headers in production fixtures. Always verify power sequencing per the datasheet: core (1.8V) must stabilize before or simultaneously with I/O (3.3V) to avoid latch-up.

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