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LM2755TM/NOPB
Texas Instruments
IC LED DRV RGLTR I2C 18DSBGA
19199 Pcs New Original In Stock
LED Driver IC 3 Output DC DC Regulator Switched Capacitor (Charge Pump) I2C Dimming 30mA 18-DSBGA
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5.0 / 5.0
- (352 Ratings)
LM2755TM/NOPB
Product Overview
1290592
DiGi Electronics Part Number
LM2755TM/NOPB-DGManufacturer
Texas Instruments
LM2755TM/NOPB
Description
IC LED DRV RGLTR I2C 18DSBGAInventory
19199 Pcs New Original In Stock
LED Driver IC 3 Output DC DC Regulator Switched Capacitor (Charge Pump) I2C Dimming 30mA 18-DSBGA
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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LM2755TM/NOPB Technical Specifications
Category
Power Management (PMIC), LED Drivers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
-
Product Status
Active
Type
DC DC Regulator
Topology
Switched Capacitor (Charge Pump)
Internal Switch(s)
Yes
Number of Outputs
3
Voltage - Supply (Min)
2.7V
Voltage - Supply (Max)
5.5V
Voltage - Output
-
Current - Output / Channel
30mA
Frequency
1.25MHz
Dimming
I2C
Applications
Backlight
Operating Temperature
-30°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
18-WFBGA
Supplier Device Package
18-DSBGA
Base Product Number
LM2755
Datasheet & Documents
HTML Datasheet
LM2755TM/NOPB-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
LM2755TMTR-DG
LM2755TM/NOPBCT
LM2755TMCT-DG
LM2755TMNOPB
*LM2755TM/NOPB
LM2755TMCT
LM2755TMTR
2156-LM2755TM/NOPB-TI
NATNSCLM2755TM/NOPB
LM2755TM/NOPBDKR
LM2755TMDKR-DG
LM2755TM/NOPBTR
LM2755TMDKR
Standard Package
250
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
처음 이용했지만, 고객 센터의 응대가 정말 좋았어요. 배송도 신속하고 깔끔했어요.
Dec 02, 2025
Le service après-vente est très attentif ; ils ont répondu à toutes mes questions de manière claire et rapide.
Dec 02, 2025
Their customer support team is genuinely friendly and always eager to help.
Dec 02, 2025
Their variety of options allows for customized solutions to unique customer needs.
Dec 02, 2025
They handle after-sales communication efficiently, which I appreciate.
Dec 02, 2025
The durability and packaging quality together provide great confidence in this purchase.
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Frequently Asked Questions (FAQ)
What are the key design risks when using the LM2755TM/NOPB in a compact handheld device with limited PCB real estate, and how can I mitigate layout-related noise issues?
The LM2755TM/NOPB’s 18-DSBGA package and switched-capacitor topology require careful attention to parasitic inductance and capacitance due to its 1.25MHz switching frequency. In space-constrained designs, poor placement of bypass capacitors or long traces to flying capacitors can induce voltage ripple and EMI, degrading LED brightness stability. To mitigate this, place the input and flying capacitors (typically 1μF X5R/X7R ceramic) within 2mm of the IC pins, use a solid ground plane beneath the device, and avoid routing sensitive I2C lines near switching nodes. TI’s evaluation module layout (SNOA832) provides a proven reference for minimizing loop areas and thermal hotspots.
Can the LM2755TM/NOPB safely drive high-brightness white LEDs in a battery-powered application where input voltage may drop below 3.0V, and what happens during brownout conditions?
Yes, the LM2755TM/NOPB operates down to 2.7V, making it suitable for single-cell Li-ion applications where voltage sags under load. However, as the input approaches 2.7V, the charge pump may struggle to maintain regulated output current, leading to dimming or flicker—especially if LED forward voltage exceeds the boosted level. To prevent erratic behavior during brownout, implement a low-battery detection circuit that disables the I2C interface or reduces brightness proactively. Avoid relying solely on the IC’s undervoltage lockout (UVLO), which is not user-configurable; instead, monitor VIN with a comparator or MCU ADC and gracefully shut down the LM2755TM/NOPB before critical dropout.
Is the LM2755TM/NOPB a drop-in replacement for the MAX1575 in a legacy backlight design, and what firmware or hardware changes are needed?
The LM2755TM/NOPB is not a direct drop-in for the Maxim Integrated MAX1575 due to differences in control interface and output configuration. While both are 3-output charge-pump LED drivers, the MAX1575 uses analog/PWM dimming, whereas the LM2755TM/NOPB relies on I2C for digital control. Replacing it requires updating firmware to configure brightness via I2C registers and potentially modifying the PCB to accommodate the 18-DSBGA footprint versus the MAX1575’s 10-pin µMAX. Additionally, verify that the target LEDs’ total current draw (up to 90mA across three channels) stays within the LM2755TM/NOPB’s 30mA per-channel limit—exceeding this risks thermal shutdown or reduced lifespan.
How does the LM2755TM/NOPB handle thermal stress in high-ambient-temperature environments, such as automotive dashboards, and what derating should be applied?
Although the LM2755TM/NOPB is rated for -30°C to 85°C ambient temperature, sustained operation near 85°C with full 30mA per channel can cause junction temperatures to exceed safe limits due to the low thermal conductivity of the DSBGA package. In automotive or enclosed industrial applications, derate output current by at least 20% above 70°C ambient to prevent thermal throttling or long-term reliability degradation. Use TI’s thermal resistance model (θJA ≈ 50°C/W) to estimate junction temperature: Tj = TA + (PD × θJA), where PD includes switching and conduction losses. Adding a small copper pour under the package (connected to GND) improves heat dissipation significantly.
What are the reliability implications of using the LM2755TM/NOPB in a high-vibration environment like industrial handheld scanners, and how does its MSL-1 rating affect assembly?
The LM2755TM/NOPB’s MSL-1 (unlimited floor life) rating simplifies handling and reduces moisture-related defects during reflow, which is advantageous in high-volume production. However, in high-vibration settings, the 18-DSBGA package’s small solder joints are susceptible to fatigue over time, especially if the PCB lacks adequate mechanical support. To enhance reliability, use underfill epoxy if the device is mounted on a flexing substrate, ensure symmetric pad design to balance solder wettability, and avoid placing the IC near board edges or connectors subject to shock. Additionally, validate solder joint integrity through thermal cycling tests (-40°C to 105°C) to simulate long-term field stress, as intermittent I2C communication failures may indicate microcracks.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
LM2755TM/NOPB CAD Models
Texas Instruments LM2755TM/NOPB PCB symbols & footprints
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