MMB02070C1609FB200 >
MMB02070C1609FB200
Vishay Beyschlag/Draloric/BC Components
MMB 0207-50 1% B2 16R
3123 Pcs New Original In Stock
Chip Resistor
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MMB02070C1609FB200
5.0 / 5.0 - (389 Ratings)

MMB02070C1609FB200

Product Overview

2069466

DiGi Electronics Part Number

MMB02070C1609FB200-DG
MMB02070C1609FB200

Description

MMB 0207-50 1% B2 16R

Inventory

3123 Pcs New Original In Stock
Chip Resistor
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 2000 0.0739 147.7520
  • 6000 0.0665 398.9304
  • 10000 0.0650 650.0720
  • 50000 0.0629 3144.7700
  • 100000 0.0623 6229.3800
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MMB02070C1609FB200 Technical Specifications

Category Chip Resistor - Surface Mount

Manufacturer Vishay BC Components

Packaging Tape & Reel (TR)

Series *

Product Status Active

Datasheet & Documents

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8533.21.0040

Additional Information

Other Names
749-MMB02070C1609FB200TR
749-MMB02070C1609FB200DKR
749-MMB02070C1609FB200CT
Standard Package
2,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
星***者
Dec 02, 2025
5.0
他們的產品品質一直都很穩定,售後服務也很貼心,每次購物都很愉快!
AubeB***lante
Dec 02, 2025
5.0
Je suis très satisfait de leur capacité à maintenir un inventaire complet.
Vibr***Vibes
Dec 02, 2025
5.0
My order was dispatched rapidly and arrived without any delays.
Crea***eCove
Dec 02, 2025
5.0
I value their proactive approach in addressing any issues that may arise.
Wildf***erSoul
Dec 02, 2025
5.0
Super quick delivery and very helpful support staff.
Drea***aver
Dec 02, 2025
5.0
Site visuals and icons are clean, helping me focus on shopping.
Peacef***ourney
Dec 02, 2025
5.0
Reliable shipping times keep my projects on schedule.
Azure***izons
Dec 02, 2025
5.0
I can always count on DiGi Electronics to provide products that are both innovative and dependable.
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Frequently Asked Questions (FAQ)

What are the key design-in risks when using MMB02070C1609FB200 in high-density PCB layouts with tight thermal margins?

When integrating the MMB02070C1609FB200 into high-density designs, thermal coupling between adjacent components can exceed the resistor's derated power capability despite its 0.25W rating. Since this device uses a 0207 (2.0 x 1.75mm) footprint, ensure adjacent copper pours or heat-generating ICs don’t restrict convection cooling. To mitigate risk, simulate board-level thermal performance or measure prototype temperatures under worst-case load, particularly when multiple MMB02070C1600FB200 resistors operate above 70°C ambient. Consider adding thermal vias or increasing spacing to maintain reliability within Vishay’s recommended operating conditions.

How does the MMB02070C1609FB200 compare to the Yageo RC0207JR-0716R in terms of long-term stability and moisture resistance for outdoor applications?

The MMB02070C1609FB200 and Yageo RC0207JR-0716R are both 0207-sized 16Ω 1% thin-film resistors, but the MMB02070C1609FB200 offers superior moisture resistance due to its MSL 1 (unlimited) rating and robust termination construction, making it better suited for outdoor or humid environments. The Vishay part also shows tighter TCR performance in real-world thermal cycling (typically ±25ppm/°C vs. ±50ppm/°C for RC0207JR-0716R). For mission-critical outdoor electronics such as telecom or industrial sensors, selecting the MMB02070C1609FB200 reduces drift-related calibration issues over time.

Can the MMB02070C1609FB200 be used as a direct replacement for the obsolete Panasonic ERJ-2RKF1601X in precision current sensing circuits?

Yes, the MMB02070C1609FB200 can replace the Panasonic ERJ-2RKF1601X in low-side or differential current sensing applications, but with design verification. While both offer 0.25W power rating, 1% tolerance, and 16Ω resistance, the MMB02070C1609FB200 has a lower typical TCR (±100ppm/°C vs. ±50ppm/°C for the ERJ part), which may introduce slightly higher drift under thermal transients. To ensure stability, include a small thermal pad or isolation slot near the MMB02070C1609FB200 on the PCB, and validate performance during power-up cycles to avoid gain errors in amplification stages.

What are the reliability concerns when using MMB02070C1609FB200 in automotive under-hood applications near ECU power rails?

Although the MMB02070C1609FB200 is AEC-Q200 non-compliant, its MSL 1 and robust construction make it usable in automotive under-hood environments with caution. The main risk is long-term exposure to thermal cycling (−40°C to +125°C) and voltage transients on power rails. For non-safety-critical functions (e.g., sensor pull-ups or level shifting), the MMB02070C1609FB200 can perform reliably if derated to 50% of rated power and isolated from mechanical stress via compliant mounting. However, for safety-related systems, opt for AEC-Q200 qualified equivalents like the CRCW020716R0FKEA instead.

How should I validate solder joint integrity for MMB02070C1609FB200 when reflowing on lead-free assembly lines with high board thickness?

For reliable solder joints with the MMB02070C1609FB200 on thick, multilayer PCBs using lead-free reflow, ensure the thermal profile achieves peak temperatures of 240–250°C with adequate soak time to prevent tombstoning or insufficient wetting. Due to the 0207 package's asymmetrical thermal mass, thick boards may create uneven heating. To mitigate risk, use balanced pad designs per IPC-7351, verify stencil aperture alignment, and conduct post-reflow X-ray or cross-section sampling during initial production. The MMB02070C1609FB200’s terminations are nickel/tin-plated, which are compatible with SAC305, but poor profiles can still lead to micro-cracks under vibration stress.

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