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IDC2512ER1R0M
Vishay Dale
FIXED IND 1UH 2.9A 50 MOHM SMD
3319 Pcs New Original In Stock
1 µH Unshielded Drum Core, Wirewound Inductor 2.9 A 50mOhm Max 2512 (6432 Metric)
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5.0 / 5.0
- (142 Ratings)
IDC2512ER1R0M
Product Overview
1168741
DiGi Electronics Part Number
IDC2512ER1R0M-DGManufacturer
Vishay Dale
IDC2512ER1R0M
Description
FIXED IND 1UH 2.9A 50 MOHM SMDInventory
3319 Pcs New Original In Stock
1 µH Unshielded Drum Core, Wirewound Inductor 2.9 A 50mOhm Max 2512 (6432 Metric)
Quantity
Minimum 1
Minimum 1
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IDC2512ER1R0M Technical Specifications
Category
Fixed Inductors
Packaging
Tape & Reel (TR)
Series
IDC-2512
Product Status
Active
Type
Drum Core, Wirewound
Material - Core
Ferrite
Inductance
1 µH
Tolerance
±20%
Current Rating (Amps)
2.9 A
Current - Saturation (Isat)
2.9A
Shielding
Unshielded
DC Resistance (DCR)
50mOhm Max
Q @ Freq
-
Frequency - Self Resonant
-
Ratings
-
Operating Temperature
-40°C ~ 125°C
Inductance Frequency - Test
100 kHz
Mounting Type
Surface Mount
Package / Case
2512 (6432 Metric)
Supplier Device Package
-
Size / Dimension
0.260" L x 0.175" W (6.60mm x 4.45mm)
Height - Seated (Max)
0.115" (2.92mm)
Datasheet & Documents
HTML Datasheet
IDC2512ER1R0M-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.4000
Additional Information
Standard Package
2,500
Alternative Parts
View DetailsPART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
늘 기대 이상인 제품과 빠른 배송, 정말 만족스럽습니다.
Dec 02, 2025
親切なカスタマーサービスのおかげで、快適に買い物できました。
Dec 02, 2025
I appreciate how affordable their products are while still maintaining excellent reliability.
Dec 02, 2025
Their professional service and affordable prices make them a leader in the industry.
Dec 02, 2025
Despite the budget-friendly prices, their packaging feels premium and sturdy.
Dec 02, 2025
DiGi Electronics offers a diverse range of products that always meet my expectations.
Dec 02, 2025
Received my items rapidly, with packaging that thoughtfully protected everything.
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Frequently Asked Questions (FAQ)
What are the key reliability risks when using the IDC2512ER1R0M in high-vibration automotive applications, and how can I mitigate them despite its unshielded drum core design?
The IDC2512ER1R0M’s unshielded drum core and wirewound construction make it susceptible to mechanical fatigue and microcracking under sustained high vibration, especially in under-hood or chassis-mounted automotive systems. Although it meets AEC-Q200 requirements indirectly via Vishay’s testing protocols, the lack of shielding increases susceptibility to nearby magnetic interference and reduces structural rigidity. To mitigate risk, secure the PCB with conformal coating over the component, avoid placement near high-stress mounting points, and consider mechanical anchoring with low-stress adhesive. For mission-critical paths, evaluate shielded alternatives like the Bourns SRN6045TA-1R0Y or compare with the substitute P0770.102NLT, which uses a molded shield for better vibration resilience.
Can I safely replace the IDC2512ER1R0M with the suggested substitute P0770.102NLT in a 2.5 A buck converter without redesigning the feedback loop?
While the P0770.102NLT has similar inductance (1 µH) and current rating (2.8 A Isat), its shielded construction and different core material result in a lower DCR (38 mΩ vs. 50 mΩ max) and higher parasitic capacitance, which can shift the converter’s control loop stability margin. The IDC2512ER1R0M’s unshielded design has a cleaner high-frequency response, so direct drop-in replacement may cause subharmonic oscillation or increased output ripple in peak-current-mode controllers. Always validate transient response and phase margin with a Bode plot if replacing; if loop compensation is fixed, stick with the IDC2512ER1R0M or adjust compensation network values based on impedance profiling.
How does the ±20% inductance tolerance of the IDC2512ER1R0M impact efficiency and ripple in a 500 kHz synchronous buck converter, and should I bin parts for critical designs?
A ±20% tolerance on the 1 µH IDC2512ER1R0M means actual inductance could range from 0.8 µH to 1.2 µH, directly affecting peak-to-peak ripple current (ΔI_L ∝ 1/L). At 500 kHz, this variation can swing ΔI_L by ±25%, increasing RMS current in the MOSFETs and output capacitors at the low-L end, reducing efficiency by 1–3% in worst-case scenarios. In high-volume or efficiency-critical designs (e.g., battery-powered systems), consider sourcing binned lots or adding a small margin to the nominal inductance in simulation. Alternatively, use a controller with adaptive dead-time control or current-mode architecture that inherently compensates for inductance variation.
Is the IDC2512ER1R0M suitable for parallel operation in a multi-phase power supply, given its wirewound construction and lack of tight DCR matching?
Parallel operation of the IDC2512ER1R0M is not recommended without active current balancing due to inherent DCR variation (±20% typical across batches) and thermal coupling effects. Wirewound inductors like the IDC2512ER1R0M exhibit positive temperature coefficients, meaning a slightly lower DCR unit will carry more current, heat up slower, and further increase current imbalance—potentially leading to thermal runaway. If paralleling is unavoidable, use individual current-sense resistors per phase and ensure symmetric layout with tight thermal coupling. For scalable multi-phase designs, consider using coupled inductors or shielded, tightly tolerance-matched alternatives such as the Coilcraft XAL7070-102ME.
What layout precautions are critical when placing the IDC2512ER1R0M near sensitive analog circuitry, given its unshielded ferrite core and 2.9 A saturation current?
The unshielded drum core of the IDC2512ER1R0M generates significant near-field magnetic flux, especially during load transients when operating near its 2.9 A saturation point. This can induce noise in adjacent high-impedance analog traces (e.g., ADC inputs, op-amp feedback paths) even at several millimeters distance. Maintain a minimum 5 mm clearance from sensitive circuits, orient the inductor perpendicular to critical traces to minimize mutual inductance, and use a grounded copper pour (with stitching vias) as a partial magnetic barrier. Avoid routing return paths beneath the IDC2512ER1R0M. For dense layouts, consider replacing it with a shielded equivalent like the Wurth WE-LQS 744040110, which reduces stray field by >80% despite slightly larger footprint.
Quality Assurance (QC)
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IDC2512ER1R0M CAD Models
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