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IHLP2020BZER1R0MA1
Vishay Dale
IHLP-2020BZ-A1 1 20% ER E3
2507 Pcs New Original In Stock
1 µH Shielded Inductor 7 A 20mOhm Max Nonstandard
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5.0 / 5.0
- (103 Ratings)
IHLP2020BZER1R0MA1
Product Overview
10410799
DiGi Electronics Part Number
IHLP2020BZER1R0MA1-DGManufacturer
Vishay Dale
IHLP2020BZER1R0MA1
Description
IHLP-2020BZ-A1 1 20% ER E3Inventory
2507 Pcs New Original In Stock
1 µH Shielded Inductor 7 A 20mOhm Max Nonstandard
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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IHLP2020BZER1R0MA1 Technical Specifications
Category
Fixed Inductors
Packaging
Tape & Reel (TR)
Series
IHLP-2020BZ-A1
Product Status
Active
Type
-
Material - Core
Metal Composite
Inductance
1 µH
Tolerance
±20%
Current Rating (Amps)
7 A
Current - Saturation (Isat)
16A
Shielding
Shielded
DC Resistance (DCR)
20mOhm Max
Q @ Freq
-
Frequency - Self Resonant
62MHz
Ratings
AEC-Q200
Operating Temperature
-55°C ~ 125°C
Inductance Frequency - Test
100 kHz
Features
-
Mounting Type
Surface Mount
Package / Case
Nonstandard
Supplier Device Package
-
Size / Dimension
0.216" L x 0.204" W (5.49mm x 5.18mm)
Height - Seated (Max)
0.079" (2.00mm)
Datasheet & Documents
HTML Datasheet
IHLP2020BZER1R0MA1-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.8000
Additional Information
Other Names
541-IHLP2020BZER1R0MA1TR
541-IHLP2020BZER1R0MA1CT
541-IHLP2020BZER1R0MA1DKR
Standard Package
2,000
Alternative Parts
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QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
每次在Digit Electronics購物，商品價格都比其他商家便宜不少，真心推薦！
Dec 02, 2025
Ich bin begeistert von der schnellen Versandabwicklung und dem stets freundlichen Kundenservice.
Dec 02, 2025
The packaging provided by DiGi Electronics is always complete and secure.
Dec 02, 2025
Their fast shipping process keeps my innovations flowing without interruptions.
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Frequently Asked Questions (FAQ)
Can the IHLP2020BZER1R0MA1 inductor be safely used as a drop-in replacement for the ETQ-P3M1R0KVP in a high-current buck converter operating at 500 kHz, and what design risks should I evaluate before making the swap?
While both the IHLP2020BZER1R0MA1 and ETQ-P3M1R0KVP are 1 µH shielded inductors rated for similar saturation currents (~16A vs. ~15A), direct drop-in replacement requires careful evaluation of core loss, DCR, and thermal performance under your specific load profile. The IHLP2020BZER1R0MA1 has a lower max DCR (20mΩ vs. ~25mΩ for the ETQ-P3M1R0KVP), which may improve efficiency, but its metal composite core exhibits higher core losses at 500 kHz compared to the powdered iron core of the Panasonic part. Verify thermal rise under worst-case ripple current using Vishay’s online simulation tools, and ensure PCB pad compatibility—the IHLP2020BZER1R0MA1’s nonstandard footprint may require layout adjustments despite similar outer dimensions.
What are the key reliability concerns when using the IHLP2020BZER1R0MA1 in an automotive-grade DC-DC converter that must comply with AEC-Q200, especially regarding thermal cycling and long-term inductance stability?
The IHLP2020BZER1R0MA1 is AEC-Q200 qualified, making it suitable for automotive applications, but its metal composite core can exhibit slight inductance drift over extreme thermal cycles (-55°C to 125°C). While this drift is typically within ±5% and stable after initial burn-in, mission-critical systems should include margin in control loop design to accommodate potential minor shifts. Additionally, ensure solder joints are void-free during reflow—the component’s low profile (2.00mm height) increases sensitivity to tombstoning; use a symmetric pad layout and controlled ramp-up profile. Long-term DC bias performance is excellent due to the shielded construction, but validate aging effects under sustained 7A+ loads in your target environment.
How does the self-resonant frequency (SRF) of 62 MHz for the IHLP2020BZER1R0MA1 impact its usability in a 2 MHz multiphase POL regulator, and could parasitic capacitance cause instability or EMI issues?
With an SRF of 62 MHz, the IHLP2020BZER1R0MA1 remains well above the 2 MHz switching frequency and its harmonics, so it will not enter capacitive mode during normal operation. However, the proximity of the SRF to common EMI filter cutoff frequencies (often 10–50 MHz) means layout parasitics can interact with the inductor’s inherent capacitance, potentially creating unintended resonances. To mitigate this, minimize loop area between the inductor, input/output capacitors, and switch node, and avoid routing sensitive feedback traces near the component. If conducted emissions testing shows peaks near 30–60 MHz, consider adding a small RC snubber or selecting a part with higher SRF, though the IHLP2020BZER1R0MA1’s shielding already provides strong EMI suppression.
Is the IHLP2020BZER1R0MA1 suitable for high-density power stages where board space is constrained, and how does its 2.00mm seated height compare to competing molded inductors like the Coilcraft XAL6060?
Yes, the IHLP2020BZER1R0MA1 is ideal for space-constrained designs due to its ultra-low 2.00mm profile and compact 5.49mm x 5.18mm footprint. Compared to the Coilcraft XAL6060-102MEB (also 1 µH, 6.0mm x 6.0mm x 3.0mm), the Vishay part saves ~30% board area and 33% height—critical for blade servers or portable medical devices. However, the XAL6060 offers slightly better thermal performance due to its larger surface area, so if your application operates near the 7A RMS limit in elevated ambient temperatures (>85°C), perform thermal derating analysis. The IHLP2020BZER1R0MA1’s metal composite core also provides superior soft saturation behavior, reducing risk of sudden inductance collapse under transient overloads.
What precautions should I take when designing the PCB footprint for the IHLP2020BZER1R0MA1, given its nonstandard package and sensitivity to mechanical stress during assembly?
The IHLP2020BZER1R0MA1 uses a nonstandard land pattern that differs subtly from JEDEC-compliant molded inductors—relying on Vishay’s recommended footprint (available in their datasheet or CAD models) is essential to prevent tombstoning or solder bridging. Key design tips: use symmetrical, teardrop-shaped pads with 0.25–0.30mm solder mask defined (SMD) openings to control fillet formation; avoid placing vias directly under the component; and maintain a minimum 0.5mm clearance from adjacent components to allow for rework. Due to its ceramic-like metal composite construction, the part is brittle—excessive board flexure during depaneling or conformal coating can cause microcracks. Reinforce the assembly with strain relief features or selective coating exclusion zones if the PCB is subject to mechanical bending in the final product.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
IHLP2020BZER1R0MA1 CAD Models
Vishay Dale IHLP2020BZER1R0MA1 PCB symbols & footprints
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