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1210X475K250CT
Walsin Technology Corporation
CAP CER 4.7UF 25V X5R 1210
2503 Pcs New Original In Stock
4.7 µF ±10% 25V Ceramic Capacitor X5R 1210 (3225 Metric)
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5.0 / 5.0
- (215 Ratings)
1210X475K250CT
Product Overview
10453546
DiGi Electronics Part Number
1210X475K250CT-DGManufacturer
Walsin Technology Corporation
1210X475K250CT
Description
CAP CER 4.7UF 25V X5R 1210Inventory
2503 Pcs New Original In Stock
4.7 µF ±10% 25V Ceramic Capacitor X5R 1210 (3225 Metric)
Quantity
Minimum 1
Minimum 1
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1210X475K250CT Technical Specifications
Category
Ceramic Capacitors
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Capacitance
4.7 µF
Tolerance
±10%
Voltage - Rated
25V
Temperature Coefficient
X5R
Operating Temperature
-55°C ~ 85°C
Features
-
Ratings
-
Applications
General Purpose
Failure Rate
-
Mounting Type
Surface Mount, MLCC
Package / Case
1210 (3225 Metric)
Size / Dimension
0.126" L x 0.098" W (3.20mm x 2.50mm)
Height - Seated (Max)
-
Thickness (Max)
0.087" (2.20mm)
Lead Spacing
-
Lead Style
-
Datasheet & Documents
HTML Datasheet
1210X475K250CT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8532.24.0020
Additional Information
Other Names
1292-1210X475K250CTTR
Standard Package
1,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Les tarifs qu'ils proposent sont très compétitifs, et leur support après-vente est fiable.
Dec 02, 2025
DiGi Electronics bietet einen fantastischen Service mit schneller Lieferung und hilfreichem Support.
Dec 02, 2025
I appreciate how quickly DiGi Electronics dispatches orders, greatly improving my workflow.
Dec 02, 2025
I always feel valued thanks to their attentive and efficient post-purchase support.
Dec 02, 2025
Shipping was exceptionally quick; I received my order within a few days.
Dec 02, 2025
Their logistics efficiency reduces unnecessary delays and costs.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the 1210X475K250CT in a high-temperature environment near 85°C and how can capacitance drift affect circuit performance?
When designing in the 1210X475K250CT, engineers must account for X5R dielectric behavior near its upper operating temperature limit of 85°C, where capacitance can drop by up to 15% from room-temperature values due to temperature and DC bias effects. At 25V rated voltage with even moderate DC bias (e.g., 15–20V), effective capacitance in-circuit may fall below 4µF, impacting power supply filtering or bypass performance. To mitigate, verify performance using Walsin’s DC bias and temperature curves, and consider a higher voltage rating (e.g., 50V) or larger case size if stable capacitance is critical. Always derate voltage by at least 50% for reliability in sustained thermal environments with the 1210X475K250CT.
Can the 1210X475K250CT be used as a drop-in replacement for the Murata GRM325R71E476KE15L in a 24V rail decoupling application, and what are the reliability trade-offs?
While both the 1210X475K250CT and Murata GRM325R71E476KE15L are 1210, 4.7µF, 25V X5R MLCCs, direct replacement requires caution. The Murata part uses X7R dielectric (±15% tol, -55°C to 125°C), offering better temperature stability versus the 1210X475K250CT’s X5R (-55°C to 85°C). In a 24V rail with potential transient spikes above 20V, the 1210X475K250CT experiences significant capacitance loss under bias—possibly worse than Murata’s part. Additionally, Murata’s EIA-198D testing provides better aging and reliability data. For drop-in use with the 1210X475K250CT, confirm voltage derating (ideally <12.5V DC), assess lifetime temperature exposure, and perform board-level verification of impedance and capacitance under real operating conditions.
How does PCB layout influence mechanical stress reliability when using the 1210X475K250CT in high-vibration industrial systems?
The 1210X475K250CT’s 3225 case size and 2.2mm thickness make it susceptible to board flex cracking under mechanical stress. In high-vibration applications, poor layout—such as placing the capacitor near board edges, mounting holes, or connectors—increases risk of ceramic fracture and latent short circuits. To enhance reliability with the 1210X475K250CT, orient the long axis parallel to expected flex directions, avoid via-in-pad or stiff thermal reliefs, and use compliant solder joints. Consider edge termination or flexible terminations (e.g., Samsung’s IML series) if vibration exceeds 10g. Also, avoid hand rework or mechanical fixturing after assembly to prevent microcracks.
What are the implications of using the 1210X475K250CT in a high-density BYPASS network where multiple MLCCs share a common power rail?
When deploying the 1210X475K250CT in parallel with smaller MLCCs (e.g., 0603/0805) for broadband bypass, mutual resonances and impedance peaks may arise due to inductive interactions between packages. The 1210X475K250CT’s higher ESL (~1.5nH) compared to smaller case sizes can create anti-resonance dips around 10–20MHz, undermining high-frequency noise suppression. Minimize loop inductance by placing 1210X475K250CT close to power entry points and pair with low-ESL packages for MHz+ performance. Use staggered dielectrics (e.g., X5R + C0G) cautiously, as differing bias characteristics can skew effective bulk capacitance. Simulate total impedance profile with parasitics to verify performance with the 1210X475K250CT in your stack-up.
How does solder reflow profile selection impact long-term reliability of the 1210X475K250CT, especially given its MSL1 rating?
Despite the 1210X475K250CT’s MSL1 (unlimited floor life), an improper reflow profile can still induce latent damage. Excessive peak temperature (>260°C) or rapid thermal ramp rates (>3°C/sec) risk cracking the ceramic due to thermal shock, especially in large-body 1210 caps. Use a profile with preheat slope ≤2.5°C/sec, soak time 60–120 sec, and peak at 245–255°C to ensure complete reflow without overstressing the 1210X475K250CT. Verify consistency with inline thermal profiling and avoid double reflow unless necessary—each exposure increases stress. For lead-free assembly, ensure compatibility with SAC305 and validate post-reflow electrical testing for insulation resistance to catch micro-defects early.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
1210X475K250CT CAD Models
Walsin Technology Corporation 1210X475K250CT PCB symbols & footprints
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